Nissan Chemical Industries Limited

Nissan Chemical Corporation

Mamoru Tamura

Tomoyuki Enomoto

Takahiro Kishioka

Hiroto Ogata

Takuya Ohashi

Yuki Usui

Hiroshi Ogino

Makoto Nakajima

Yuto Hashimoto

Tetsuo Sato

Tomotada Hirohara

Yuki Kato

A composition for forming a resist underlayer film that enables the formation of a desired resist pattern; and a method for producing a resist pattern and a method for producing a semiconductor device, each of which uses said composition for forming a resist underlayer film. A resist underlayer film-forming composition includes a solvent and a polymer having a unit structure represented by formula (I): (in formula (I), A, A, A, A, A, and Aeach independently represent a hydrogen atom, a methyl group, or an ethyl group, Qrepresents a divalent organic group, Rrepresents a tetravalent organic group including a C6-40 aromatic ring structure, and Land Leach independently represent a hydrogen atom or a C1-10 alkyl group optionally substituted with a hydroxy group and optionally interrupted by an oxygen atom).

Resist underlayer film-forming composition including reaction product of acid dianhydride

A resist underlayer film forming composition contains a resin containing a unit structure represented by formula (1): [in formula (1), R1 represents a thiadiazole group which is optionally substituted with a C1-6 alkyl group optionally interrupted by a carboxy group, a C1-6 alkyl group optionally substituted with a hydroxyl group, or a C1-4 alkylthio group, and R2 represents a hydrogen atom or formula (2): (in formula (2), R1 is the same as defined above, and * represents a binding moiety)]. The resist underlayer film forming composition provides a resist underlayer film which has excellent solvent resistance, excellent optical parameters, an excellent dry etching rate, and excellent embeddability.

Resist underlying film forming composition

A method includes applying a composition for forming a resist underlayer film to a substrate having a recess in a surface, and baking the composition for forming a resist underlayer film to form a resist underlayer film for filling at least the recess. The composition for forming a resist underlayer film has a copolymer having a structural unit of following formula (1), a cross-linkable compound, a cross-linking catalyst, and a solvent:  wherein Rand Rare each independently a Calkylene group or a single bond, Z is an &#x2014;O&#x2014; group, a &#x2014;S&#x2014; group, or a &#x2014;S&#x2014;S&#x2014; group, and Ar is an arylene group.

Composition for forming resist underlayer film and method for forming resist pattern using same

A simplified method for removing foreign matters formed on a substrate in a semiconductor device manufacturing process; and a composition for forming a coating film for foreign matter removal use, which can be used in the method. A coating film is formed on a semiconductor substrate using a composition preferably containing a polyamic acid produced from (a) a tetracarboxylic dianhydride compound and (b) a diamine compound having at least one carboxyl group or a polyamic acid produced from (a) a tetracarboxylic dianhydride compound, (b) a diamine compound having at least one carboxyl group and (c) a diamine compound, and then foreign matters occurring on the coating film are removed together with the coating film by the treatment with a developing solution.

Composition for forming a coating film for removing foreign matters

A composition for forming a resist underlayer film that functions as an anti-reflective coating during exposure and can be embedded in a recess having a narrow space and a high aspect ratio, and has excellent resistance to an aqueous hydrogen peroxide solution. A resist underlayer film-forming composition containing a resin, a compound of the following Formula (1) or (1):  wherein X is carbonyl group or methylene group, 1 and m are each independently an integer of 0 to 5 and satisfy a relational expression of 3&#x2264;1+m 10, and n is an integer of 2 to 5, and a solvent, wherein the compound of Formula (1) or (1) is contained in an amount of 0.01% by mass to 60% by mass relative to the amount of the resin.

Resist underlayer film-forming composition

A composition for forming a resist underlayer film that has a high dry etching rate, functions as an anti-reflective coating during exposure, and fills a recess having a narrow space and a high aspect ratio. A composition for forming a resist underlayer film has a copolymer having a structural unit of following formula (), a cross-linkable compound, a cross-linking catalyst, and a solvent: wherein Rand Rare each independently a Calkylene group or a single bond, Z is an &#x2014;O&#x2014; group, a &#x2014;S&#x2014; group, or a &#x2014;S&#x2014;S&#x2014; group, and Ar is an arylene group. The copolymer is synthesized by a reaction of a carboxyl group of a dicarboxylic acid compound having an &#x2014;O&#x2014; group, a &#x2014;S&#x2014; group, or a &#x2014;S&#x2014;S&#x2014; group with an epoxy group of a diglycidyl ether compound having an arylene group.

There is provided a film-forming composition for forming a film that covers a substrate and exhibits good electrical insulation properties, heat resistance, and solvent resistance after heating at a low temperature. A film-forming composition including a polymer (A) containing a unit structure of Formula (1): (wherein Tis an arylene group or a combination of an arylene group with T, Tis an alkylene group, a fluorinated alkylene group, a carbonyl group, a sulfonyl group, or a combination thereof, Ris a carboxyl group, an amino group, or an imino group, and n1 is an integer of 1 to 6), and a compound (B) having at least two isocyanate groups or blocked isocyanate groups. The polymer (A) is a polymer containing a unit structure of Formula (1) or a structure (A-1) having a combination of the unit structure of Formula (1) with a unit structure of Formula (2): 

Film-forming composition including thermosetting resin

A photosensitive resin composition comprises a polymer having a repeating structural unit of the following Formula (1): (wherein Rand Rare each independently a single bond, a methylene group, or an ethylene group, Y is an alkylene group of Formula (2) or a combination of the alkylene group of Formula (2) with an alkylene group of Formula (3), n is an integer of 1 to 110, and X is a divalent aliphatic hydrocarbon group, a divalent alicyclic hydrocarbon group, or a divalent aromatic hydrocarbon group) and a (meth)acryloyl group at both ends, a bifunctional (meth)acrylate compound, a polyfunctional thiol compound, a photo-radical generator and an organic solvent, and then the bifunctional (meth)acrylate compound contained in an amount of 5% to 50% by mass and the polyfunctional thiol compound is contained in an amount of 0.1% to 10% by mass, relative to the content of the polymer.

Photosensitive resin composition and adhesives composition

There is provided a novel polymer, a composition containing the polymer, and a novel adhesive composition containing the polymer from which a cured film having desired properties is obtained. A polymer comprising a structural unit of Formula (1): wherein Q is a bivalent group, Ris a Calkylene group, a Calkenylene group or Calkynylene group, a Carylene group, a Ccyclic alkylene group, etc., or a polymer comprising a structural unit of Formula (6): wherein Qis an allyl group, a vinyl group, an epoxy group, or a glycidyl group, and Ris a bivalent organic group having a main chain containing only carbon atom or at least one of oxygen atom, nitrogen atom and sulfur atom in addition to carbon atom, a composition comprising the polymer, and an adhesive composition comprising the polymer and a solvent.

Polymer and composition including same, and adhesive composition

There is provided a composition for forming a passivation film that satisfies electric insulation, heat-tolerance, solvent-tolerance, and a dry etch back property at the same time. A composition for forming a passivation film, including: a polymer containing a unit structure of Formula (i):T-O&#x2003;&#x2003;Formula (i)(where Tis a sulfonyl group, a fluoroalkylene group, a cycloalkylene group, or an arylene group having a substituent, or is a combination of an arylene group optionally having a substituent and a fluoroalkylene group or a cycloalkylene group), wherein the polymer has at least one of a group having a structure of Formula (2-A), a group having a structure of Formula (2-B), or a group having both of the structures, at an end, in a side chain, or in a main chain of the polymer:  The polymer may contain a unit structure of Formula (1):L-O-T-O&#x2003;&#x2003;Formula (1)

Composition for forming passivation film, including resin having carbon-carbon multiple bond

A resin composition for forming an insulating film including a polymer having a structural unit of the following formula (1a) and a structural unit of the following formula (1b); and an organic solvent; wherein Tis a divalent organic group containing at least one arylene group in which at least one hydrogen atom is substituted with an amino group; and Tis a divalent organic group containing at least one arylene group having at least one substituent, wherein the substituent is a substituent of the following formula (2); and wherein Z is a divalent, aliphatic, aromatic, or alicyclic group optionally having a substituent. 

Resin composition, method for forming pattern using the same, and method for synthesizing polymer

Novel thermosetting resin composition is provided. A thermosetting resin composition containing a polymer having a repeating structural unit of the following Formula (1-a): (wherein each of Rand Ris independently a hydrogen atom, a Calkyl group, phenyl group, or a Ccyclic alkyl group, X is a single bond or a divalent organic group, and Y is a divalent organic group), and a terminal structure of the following Formula (1-b): (wherein Q is a Calkylene group, phenylene group in which at least one hydrogen atom may be substituted by a halogen atom, or a 5- or 6-membered divalent saturated heterocyclic group containing at least one nitrogen atom, and Ris a hydrogen atom or methyl group).

Thermosetting resin composition containing polymer having specific terminal structure

There is provided novel thermosetting resin composition. A thermosetting resin composition comprising a polymer having at least one structural unit of the following Formula (1): {wherein each of Rand Ris independently a hydrogen atom or a Calkyl group, X is a single bond or a divalent organic group, and Y is an arylene group of the following Formula (2): (wherein Zis a carbonyl group or a &#x2014;CONH&#x2014; group, Zis a Calkylene group or a 5- or 6-membered divalent saturated heterocyclic group containing at least one nitrogen atom, and Zis a 5- or 6-membered aromatic heterocyclic group containing two nitrogen atoms in which at least one of hydrogen atoms may be substituted by a Calkyl group)}.

Thermosetting resin composition

An adhesive composition has a polymer that contains a unit structure of Formula (1):L-O-T-O&#x2003;&#x2003;Formula (1)where Lis an arylene group or a combination of an arylene group and a sulfonyl group or a carbonyl group, and Tis a fluoroalkylene group, a cyclic alkylene group, an arylene group having a substituent, or a combination of an arylene group optionally having a substituent and a fluoroalkylene group or a cyclic alkylene group and contains, at a terminal or in a side chain or the main chain, at least one group containing a structure of Formula (2-A), a structure of Formula (2-B), or both structures: 

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Toyama, Japan

Mamoru Tamura