Versum Materials US, LLC

Medtronic, Inc.

Malcolm Grief

Mark Leonard O'Neill

Xiaobo Shi

David A Ruben

Michael F Mattes

Richard J O'Brien

Paul F Gerrish

John K Day

Hongjun Zhou

Reinaldo Mario Machado

Krishna P Murella

Jo-Ann Theresa Schwartz

Joseph D Rose

James Allen Schlueter

Dnyanesh Chandrakant Tamboli

John Edward Quincy Hughes

Steven Charles Winchester

Andrew J Dodd

Timothy Joseph Clore

Mark Leonard O'neill

Chemical mechanical polishing (CMP) compositions, methods and systems for polish cobalt or cobalt-containing substrates are provided. The CMP compositions comprise &#x3b1;-alanine, abrasive particles, a salt of phosphate, corrosion inhibitor, oxidizer and water. The cobalt chemical mechanical polishing compositions provide high removal rate of Co as well as very high selectivity of Co film vs. dielectric film, such as TEOS, SixNy (with 1.0&#x3c;x&#x3c;3.0, 1.33&#x3c;y&#x3c;4.0), low-k, and ultra low-k films.

Chemical mechanical polishing (CMP) of cobalt-containing substrate

Chemical Mechanical Planarization (CMP) polishing compositions comprising composite particles, such as ceria coated silica particles, offer low dishing, low defects, and high removal rate for polishing oxide films. Chemical Mechanical Planarization (CMP) polishing compositions have shown excellent performance using soft polishing pad.

Composite abrasive particles for chemical mechanical planarization composition and method of use thereof

Copper chemical mechanical polishing (CMP) formulation, method and system are disclosed. The CMP formulation comprises particulate materials, at least two or more amino acids, oxidizer, corrosion inhibitor, and rest being water.

Low dishing copper chemical mechanical planarization

A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.

Wafer-scale package including power source

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Phoenix, AZ, United States of America

Malcolm Grief