Nissan Chemical Industries Limited

Kyoto University

Nissan Chemical Corporation

Makiko Umezaki

Takahiro Kishioka

Taito Nishino

Hirokazu Nishimaki

Shuhei Shigaki

Ryo Karasawa

Yuki Usui

Ryuta Mizuochi

Tomoya Ohashi

Shigeo Kimura

Ayako Otani

Daisuke Sakuma

Yoshiomi Hiroi

Noriaki Fujitani

Shunsuke Iwamoto

Ayako Aihara

Kenichiro Kamei

Yusuke Horiguchi

Yong Chen

Takahiro Hamada

Li Liu

A film with reduced formation of an edge reservoir at a periphery of a film in which the edge reservoir causes an unnecessary residue that cannot be removed by an etching process, and a method for forming the film. A film forming composition for use in a lithography process includes a surfactant containing a polymer and an oligomer having a Cperfluoroalkyl partial structure. The perfluoroalkyl partial structure may further include an alkyl partial structure. The surfactant is contained in an amount of 0.0001% by mass to 1.5% by mass based on the total solid content of the film forming composition. The film forming composition further includes a coating film resin, the coating film resin is a novolac resin, a condensation epoxy resin, a (meth)acylic resin, a polyether-based resin, or a silicon-containing resin, etc. The formed film can be used as a resist underlayer film or a resist overlayer film.

Film forming composition containing fluorine-containing surfactant

Methods for forming a film with reduced formation of an edge reservoir at a periphery of a film in which the edge reservoir causes an unnecessary residue that cannot be removed by an etching process. A film forming composition for use in a lithography process includes a surfactant containing a polymer and an oligomer having a Cperfluoroalkyl partial structure. The perfluoroalkyl partial structure may further include an alkyl partial structure. The surfactant is contained in an amount of 0.0001% by mass to 1.5% by mass based on the total solid content of the film forming composition. The film forming composition further includes a coating film resin, the coating film resin is a novolac resin, a condensation epoxy resin, a (meth)acrylic resin, a polyether-based resin, or a silicon-containing resin, etc. The formed film can be used as a resist underlayer film or a resist overlayer film.

The invention provides a ligand-bonded fiber in which a ligand having affinity for a cell membrane receptor is immobilized on a fiber precursor, and a cell culture substrate capable of repeating ex vivo amplification of a cell expressing a cell membrane receptor by using the ligand-bonded fiber.

Ligand-binding fiber and cell culture substrate using said fiber

A composition for producing a fiber, containing (A) a polymer compound containing a unit structure represented by the formula (1) and a unit structure represented by the formula (2), (B) a crosslinking agent, (C) an acid compound, and (D) a solvent wherein each symbol in the formulas (1) and (2) is as described in the DESCRIPTION.

Active-ester-group-containing composition for producing fibers, and cell culture scaffold material using fibers produced from active-ester-group-containing composition

The invention provides a composition for the production of a fiber having organic solvent resistance, a fiber obtained by spinning the composition, and a biocompatible material containing the fiber. The composition contains (A) a polymer compound containing a unit structure represented by the formula (1) wherein each symbol is as described herein, (B) a crosslinking agent, (C) an acid compound, and (D) a solvent.

Fiber-forming composition and bio-compatible material using said fiber

A composition for forming a resist underlayer film to be used in a lithography process, that includes: a polymer containing unit structures of Formula (1), Formula (2), and Formula (3): the polymer being a polymer in which the unit structure of Formula (1) has a ratio of mole number (a) within a range of 0.20&#x2266;a&#x2266;0.90, the unit structure of Formula (2) has a ratio of mole number (b) within a range of 0.05&#x2266;b&#x2266;0.60, and the unit structure of Formula (3) has a ratio of mole number (c) within a range of 0.001&#x2266;c&#x2266;0.40, when a total mole number of all unit structures constituting the polymer is 1.0, and the polymer having a weight average molecular weight of 3,000 to 100,000; a crosslinkable compound; a photoacid generator; and a solvent.

Composition for forming photosensitive resist underlayer film

There is provided a novel organic silicon compound that can be used for a silane coupling agent. An organic silicon compound of Formula (1): (where Ais Formula (2) or Formula (3): E is Formula (4) or Formula (5): Rand Rare each independently a Calkyl group, Ris a hydrogen atom or a methyl group, Rand Rare each independently a Calkyl group, m, n, and p are each independently an integer of 1 to 5, and q is an integer of 1 to 3).

Organic silicon compound and silane coupling agent containing the same

A material forms a pattern by applying a photosensitive composition to a base material and drying to form a photosensitive coating and performing exposure and development, and a method for forming the pattern. A photosensitive composition includes water-soluble organic particles, and a solvent, wherein the solvent is a poor solvent for the water-soluble organic particles. Preferably, the water-soluble organic particles of the photosensitive composition includes a polymer which contains a unit structure (A) for forming organic particles, a unit structure (B) for forming interparticle crosslinkage, and a unit structure (C) for imparting dispersibility, and the photosensitive composition further includes a photoacid generator. In addition, the water-soluble organic particles of the photosensitive composition includes a polymer which contains the unit structure (A) for forming organic particles, the unit structure (B) for forming interparticle crosslinkage, the unit structure (C) for imparting dispersibility, and a unit structure (D) having a photoacid generating group.

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Toyama, Japan

Makiko Umezaki