Globalfoundries Singapore Pte. Ltd.

Luying Du

Juan Boon Tan

Fan Zhang

Bei Chao Zhang

Wei Liu

Yeow Kheng Lim

Dong Kyun Sohn

Wuping Liu

Jun Chen

Jing Hui Li

Embodiments relate to a method for forming reliable interconnects by preparing a substrate with a dielectric layer, processing the dielectric layer to serve as an IMD layer, wherein the IMD layer comprises a hybrid IMD layer comprising a plurality of dielectric materials with different k values.

Reliable interconnect integration scheme

A method of manufacture of an integrated circuit system includes: fabricating a substrate having an integrated circuit; applying a low-K dielectric layer over the integrated circuit; forming a via and a trench, in the low-K dielectric layer, over the integrated circuit; forming a structure surface by a chemical-mechanical planarization (CMP) process; and applying a direct implant to the structure surface for forming an implant layer and a metal passivation layer including repairing damage, to the low-K dielectric layer, caused by the CMP process.

Integrated circuit system employing low-k dielectrics and method of manufacture thereof

Growing community of inventors

Singapore, Singapore

Luying Du