Taiwan Semiconductor Manufacturing Comp. Ltd.

Lung-Kun Chu

Mao-Lin Huang

Jia-Ni Yu

Chung-Wei Hsu

Kuo-Cheng Chiang

Chih-Hao Wang

Kuan-Lun Cheng

Kuan-lun Cheng

Chun-Fu Lu

Ching-Wei Tsai

Wei-Hao Wu

Kuo-cheng Chiang

Kuo-Cheng Ching

Hou-Yu Chen

Chi On Chui

Hsin-Yi Lee

Huang-Lin Chao

Hung-Chang Sun

Hsiang-Pi Chang

Hou-yu Chen

In some embodiments, the present disclosure relates to an integrated chip that includes a first nanosheet field effect transistor (NSFET). The first NSFET includes a first nanosheet channel structure arranged over a substrate, a second nanosheet channel structure arranged directly over the first nanosheet channel structure, and a first gate electrode structure. The first and second nanosheet channel structures extend in parallel between first and second source/drain regions. The first gate electrode structure includes a first conductive ring and a second conductive ring that completely surround outer sidewalls of the first nanosheet channel structure and the second nanosheet channel structure, respectively, and that comprise a first material. The first gate electrode structure also includes a passivation layer that completely surrounds the first and second conductive rings, is arranged directly between the first and second nanosheet channel structures, and comprises a second material different than the first material.

Tuning threshold voltage in nanosheet transitor devices

A semiconductor device according to an embodiment includes a first gate-all-around (GAA) transistor and a second GAA transistor. The first GAA transistor includes a first plurality of channel members, a first interfacial layer over the first plurality of channel members, a first hafnium-containing dielectric layer over the first interfacial layer, and a metal gate electrode layer over the first hafnium-containing dielectric layer. The second GAA transistor includes a second plurality of channel members, a second interfacial layer over the second plurality of channel members, a second hafnium-containing dielectric layer over the second interfacial layer, and the metal gate electrode layer over the second hafnium-containing dielectric layer. A first thickness of the first interfacial layer is greater than a second thickness of the second interfacial layer. A third thickness of the first hafnium-containing dielectric layer is smaller than a fourth thickness of the second hafnium-containing dielectric layer.

Input/output semiconductor devices

A semiconductor device structure is provided. The semiconductor device structure includes a gate structure formed over nanostructures. The gate structure includes a gate dielectric layer, and a fill layer over the gate dielectric layer. The semiconductor device structure includes a protection layer formed over the fill layer, and a gate spacer layer formed adjacent to the gate structure. The semiconductor device structure includes an insulating layer formed over the protection layer, and the insulating layer is in direct contact with the gate spacer layer.

Semiconductor transistor device structure including nanostructure and gate structure with protection layer and fill layer and method for forming the same

A method includes forming a plurality of nanostructures over a substrate; etching the plurality of nanostructures to form recesses; forming source/drain regions in the recesses; removing first nanostructures of the plurality of nanostructures leaving second nanostructures of the plurality of nanostructures; depositing a gate dielectric over and around the second nanostructures; depositing a protective material over the gate dielectric; performing a fluorine treatment on the protective material; removing the protective material; depositing a first conductive material over the gate dielectric; and depositing a second conductive material over the first conductive.

Fluorine incorporation method for nanosheet

A device according to the present disclosure includes a fin structure disposed on a substrate and including a stack of semiconductor layers that are separated from each other, a dielectric fin disposed on the substrate, a spacer layer disposed on a sidewall of the dielectric fin and extending below the dielectric fin such that the spacer layer prevents the dielectric fin from interfacing with the substrate, an interfacial layer wrapping around each semiconductor layer of the stack, a gate dielectric layer disposed on the interfacial layer wrapping around each semiconductor layer of the stack, and a gate electrode layer including a first portion wrapping around the gate dielectric layer disposed on the interfacial layer and a second portion extending along the spacer layer disposed on the dielectric fin. An airgap extends between the first portion of the gate electrode layer and the second portion of the gate electrode layer.

Device having a gate electrode wrapping around semiconductor layers and proximate to a dielectric fin

A method includes providing a first channel layer of a first transistor and a second channel layer of a second transistor over a substrate, forming a dipole layer over the first channel layer and the second channel layer, forming a patterned hard mask covering the second channel layer and exposing the first channel layer, removing the dipole layer from the first channel layer, removing the patterned hard mask, performing a thermal drive-in process, forming an interfacial dielectric layer on the first channel layer and the dipole layer, and forming a high-k dielectric layer on the interfacial dielectric layer. The dipole layer includes a p-dipole material.

Semiconductor device fabrication methods and structures thereof

A semiconductor device structure is provided. The structure includes a first gate electrode layer having at least three surfaces surrounded by a first intermixed layer, wherein the first intermixed layer comprises a first material and a second material. The structure also includes a second gate electrode layer disposed below and in contact with the first gate electrode layer, the second gate electrode layer having at least three surfaces surrounded by a second intermixed layer, wherein the second intermixed layer comprises the first material and a fifth material, wherein the first gate electrode layer and the second gate electrode layer are disposed between two adjacent dielectric spacers.

Semiconductor device having nanosheet transistor and methods of fabrication thereof

A method for processing an integrated circuit includes forming first and second gate all around transistors. The method forms a dipole oxide in the first gate all around transistor without forming the dipole oxide in the second gate all around transistor. This is accomplished by entirely removing an interfacial dielectric layer and a dipole-inducing layer from semiconductor nanosheets of the second gate all around transistor before redepositing the interfacial dielectric layer on the semiconductor nanosheets of the second gate all around transistor.

Integrated circuit including dipole incorporation for threshold voltage tuning in transistors

A method for processing an integrated circuit includes forming N-type and P-type gate all around transistors and core gate all around transistors. The method deposits a first metal gate layer for the P-type transistors and a second metal gate layer for the N-type transistors. The method forms a passivation layer in-situ with the metal gate layer of the P-type transistors.

Integrated circuit with nanosheet transistors with metal gate passivation

A method of forming a semiconductor device includes forming a first dielectric layer over a first channel region in a first region and over a second channel region in a second region; introducing a first dipole element into the first dielectric layer in the first region to form a first dipole-containing gate dielectric layer in the first region; forming a second dielectric layer over the first dipole-containing gate dielectric layer; introducing fluorine into the second dielectric layer to form a first fluorine-containing gate dielectric layer over the first dipole-containing gate dielectric layer; and forming a gate electrode over the first fluorine-containing gate dielectric layer.

Method of forming a transistor device having dipole-containing gate dielectric layer and fluorine-containing gate dielectric layer

A method for processing an integrated circuit includes forming a plurality of transistors. The method utilizes a reversed tone patterning process to selectively drive dipoles into the gate dielectric layers of some of the transistors while preventing dipoles from entering the gate dielectric layers of other transistors. This process can be repeated to produce a plurality of transistors each having different threshold voltages.

Reversed tone patterning method for dipole incorporation for multiple threshold voltages

A device includes a substrate, and a first semiconductor channel over the substrate. The first semiconductor channel includes a first nanosheet of a first semiconductor material, a second nanosheet of a second semiconductor material in physical contact with a topside surface of the first nanosheet, and a third nanosheet of the second semiconductor material in physical contact with an underside surface of the first nanosheet. The first gate structure is over and laterally surrounding the first semiconductor channel, and in physical contact with the second nanosheet and the third nanosheet.

Field effect transistor and method

Multi-gate devices and methods for fabricating such are disclosed herein. An exemplary method includes forming a gate dielectric layer around first channel layers in a p-type gate region and around second channel layers in an n-type gate region. Sacrificial features are formed between the second channel layers in the n-type gate region. A p-type work function layer is formed over the gate dielectric layer in the p-type gate region and the n-type gate region. After removing the p-type work function layer from the n-type gate region, the sacrificial features are removed from between the second channel layers in the n-type gate region. An n-type work function layer is formed over the gate dielectric layer in the n-type gate region. A metal fill layer is formed over the p-type work function layer in the p-type gate region and the n-type work function layer in the n-type gate region.

P-metal gate first gate replacement process for multigate devices

A structure has stacks of semiconductor layers over a substrate and adjacent a dielectric feature. A gate dielectric is formed wrapping around each layer and the dielectric feature. A first layer of first gate electrode material is deposited over the gate dielectric and the dielectric feature. The first layer on the dielectric feature is recessed to a first height below a top surface of the dielectric feature. A second layer of the first gate electrode material is deposited over the first layer. The first gate electrode material in a first region of the substrate is removed to expose a portion of the gate dielectric in the first region, while the first gate electrode material in a second region of the substrate is preserved. A second gate electrode material is deposited over the exposed portion of the gate dielectric and over a remaining portion of the first gate electrode material.

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Taipei, Taiwan

Lung-Kun Chu