Fei Comapny

Lukáš Hübner

Jaroslav Stárek

Tomáš Onderlička

Zoltán Orémuš

Methods and apparatus are disclosed for determining a distance from a cut face of an active sample to a target plane, using data acquired from a reference sample. The active and reference samples have congruent structure, allowing reference data to be used as an index. An SEM image of the cut face is compared with the reference data to determine position within the active sample, and thereby the remaining distance to the target plane. The technique can be applied repeatedly between phases of ion beam milling until an endpoint at the target plane is reached. Consistent, accurate endpointing is achieved. The technique is suitable for preparing 5-100 nm thick lamella for TEM analysis of electronic circuits and can be used in a wide range of applications. Variations are disclosed.

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Jiříkovice, Czechia

Lukáš Hübner