St Assembly Test Services Inc.

Liop-Jin Yap

Chee-Keong Tan

Raymundo M Camenforte

Rajiv Mehta

B S Chandra Shekar

Ramamoorthi Ramesh

A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.

Testing of BGA and other CSP packages using probing techniques

A new method and apparatus is provided to quickly and reliably position, connect and dock a handler plate with a test head plate of a Universal Docking System. A handler plate is provided with roller assemblies while a test head plate is provided with matching receiver block assemblies. The roller assemblies are aligned with and partially inserted into the receiver block assemblies. Part of the roller assembly is mechanically engaged by the receiver block assembly, a mechanical linkage between an operator handle and the receiver block assembly allows the operator to complete the locking of the test head plate with the handler plate thereby at the same time establishing electrical contacts between arrays of pins that are mounted on surfaces of the handler base plate and the test head.

Method and apparatus for establishing quick and reliable connection between a semiconductor device handler plate and a semiconductor device test head plate

An apparatus was described which allows accurate and fast positioning of device kits for the input shuttle, the output shuttle, the docking plates, hot plate and testing stations within the semiconductor device manufacturing and testing applications for Ball Grid Array sockets. A method was highlighted by means of which the sockets in these shuttles and plates can be adapted to different sizes and different types of semiconductor devices. A pick up shaft described resulted in added flexibility within the semiconductor device manufacturing and testing environment.

BGA device positioner kit

A new probe socket is provided that allows for high speed and dependable contacting of points of contact on the Device Under Test. The new probe socket is aimed at a testing environment where semiconductor devices are mounted on device or package strips.

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Singapore, Singapore

Liop-Jin Yap