Lam Research Corporation

Lihua Li Huang

Hong Shih

John Edward Daugherty

Gregory R Bettencourt

John Folden Stumpf

Siwen Li

Timothy Dyer

Joseph P Doench

Duane D Scott

David Allen Ruberg

Jamie Burns

Emily P Stenta

A method for conditioning a ceramic layer with a thickness of less than 150 &#x3bc;m over a substrate is provided. The ceramic layer is cleaned. A region of the ceramic layer is scanned with a pulsed excimer laser beam at a repetition rate of 3-300 Hz.

Surface coating treatment

A method of drilling holes comprises ductile mode drilling the holes in a component of a plasma processing apparatus with a cutting tool wherein the component is made of a nonmetallic hard and brittle material. The method comprises drilling each hole in the component by controlling a depth of cut while drilling such that a portion of the brittle material undergoes high pressure phase transformation and forms amorphous portions of the brittle material during chip formation. The amorphous portions of the brittle material are removed from each hole such that a wall of each hole formed in the component has an as drilled surface roughness (Ra) of about 0.2 to 0.8 &#x3bc;m.

Ductile mode drilling methods for brittle components of plasma processing apparatuses

A method of ductile mode machining a component of a plasma processing apparatus wherein the component is made of nonmetallic hard and brittle material wherein the method comprises single point turning the component with a diamond cutting tool causing a portion of the nonmetallic hard and brittle material to undergo a high pressure phase transformation to form a ductile phase portion of the hard and brittle material during chip formation wherein a turned surface is formed from a phase changed material and the turned surface is a grooved textured surface of phase changed material.

Ductile mode machining methods for hard and brittle components of plasma processing apparatuses

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Pleasanton, CA, United States of America

Lihua Li Huang