Taiwan Semiconductor Manufacturing Comp. Ltd.

Li-Wei Kung

Yung-Cheng Chen

Chue San Yoo

Chang-Jyh Hsieh

Ming Huei Lu

Li-Kong Turn

Feng-Liang Lai

Ming-Huei Tseng

Bin-chang Chang

A composite mask suitable for multiple-patterning lithographic processes and a multiple-patterning photolithographic process utilizing the mask are disclosed. An exemplary embodiment includes receiving a mask having a plurality of sub-reticles and a substrate having one or more regions. A first sub-reticle of the plurality of sub-reticles is aligned with a first region of the one or more regions. A movement pattern is designated relative to the substrate. A first photolithographic process is performed including exposing the substrate using the mask to form a first exposed area on the substrate. An alignment of the mask relative to the substrate is shifted according to a first direction determined by the movement pattern. A second photolithographic process is performed including exposing the substrate using the mask to form a second exposed area on the substrate such that the second exposed area overlaps the first.

Multiple-patterning photolithographic mask and method

A phase shift mask comprises a transparent substrate having a patterned opaque material layer formed thereupon to form a non-transmissive region of the transparent substrate and an adjoining transmissive region of the transparent substrate. A pit is formed within the transmissive region of the transparent substrate. The pit has a stepped sidewall such as to provide the phase shift mask with enhanced optical performance. The phase shift mask may be fabricated employing a self aligned method.

Multi-step phase shift mask and methods for fabrication thereof

Single spot laser focusing systems are widely used by photolithographic stepping systems. The stage is moved until a spot, located in the immediate area in which the image is to be projected, achieves minimum size. This system is sensitive to the local topography within the area of the image and this can lead to less than optimum results. The present invention overcomes this problem by a process in which the spot is always directed to fall within an alignment mark field (as opposed to within the integrated circuit field). Several ways for accomplishing this are described.

Mark focusing system for steppers

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Chong-Her, Taiwan

Li-Wei Kung