International Business Machines Corporation

Infineon Technologies Ag

Li Ming Wang

Hilton T Toy

Lewis Sigmund Goldmann

Peter Jeffrey Brofman

Raymond A Jackson

Patrick Anthony Coico

William Edward Sablinski

Kathleen Ann Stalter

Mark G Courtney

Xiangdong Chen

Shaji Farooq

Suryanarayana Kaja

Tawei Hu

Lily Liang

Khanh M Le

Howard Hao Zhang

Thomas Boehler

Edward Joseph Perry

Vasudev Dasappa

External test equipment is used to simulate an internal BIST test, thus enabling the capture or generation of detailed test results. By simulating the BIST test sequence in real time during the test, the external tester may monitor an output from the BIST and determine the exact location of failures when they occur. The external tester may generate a bit fail map indicating whether each memory location passed or failed the BIST test.

Built-in self test system and method

A structure and method are provided for a conductor line stack of an integrated circuit. The conductor line stack includes a layer of a first material such as heavily doped polysilicon or a metal silicide. A layer of a second material such as a metal is formed over the layer of first material, the layer of second material having an upper portion and a lower portion. A pair of first spacers is disposed on sidewalls of the upper portion, wherein the lower portion has width defined by a combined width of the upper portion and the pair of first spacers. A pair of second spacers is formed on sidewalls of the first spacers, the lower portion and the layer of first material. The conductor line stack structure is well adapted for formation of a borderless bitline contact in contact therewith.

Conductor line stack having a top portion of a second layer that is smaller than the bottom portion

A content management system is provided including a plurality of tables forming a tree-based storage hierarchy. The system includes a stored procedure which enables information to be retrieved from different arbitrary locations throughout the storage hierarchy. Advantageously, the system retrieves information from both simple and complex tree-based storage hierarchies.

Content management system and methodology employing a tree-based table hierarchy featuring arbitrary information retrieval from different locations in the hierarchy

A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

Solder disc connection

The present invention relates generally to high density pluggable connector array and process thereof. More particularly, the invention encompasses a structure comprising high density pluggable connector arrays. A process for making such types of high density pluggable connector arrays is also disclosed.

High density pluggable connector array and process thereof

A device for removal of a semiconductor chip interconnected to a substrate package via solder ball connections, for instance, includes an ultrasonic transducer for providing lateral ultrasonic vibration. A converter is coupled between the ultrasonic transducer and semiconductor chip for converting the lateral ultrasonic vibration to a torsional ultrasonic vibration, wherein the torsional ultrasonic vibration is perpendicular to the lateral ultrasonic vibration. The lateral-to-torsional converter further applies the torsional ultrasonic vibration to the chip for facilitating its removal from the substrate package. A method for removal of a semiconductor chip interconnected to a substrate package is also disclosed.

Ultrasonic chip removal method and apparatus

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Darnestown, MD, United States of America

Li Ming Wang