Dow Global Technolgoies LLC

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Leo H Chiang

Andrew Wank

William A Heeschen

James David Tate

Mark Gazze

Jeff Tsai

Swee-Teng Chin

Scott Chang

Francis V Acholla

A polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.

Polishing layer analyzer and method

A method of manufacturing chemical mechanical polishing pads is provided, wherein an automated inspection system is configured to detect macro inhomogeneities is skived sheets and to classify the skived sheets as either acceptable or suspect; wherein the acceptable skived sheets are further processed to form polishing layers of chemical mechanical polishing pads.

Method of manufacturing chemical mechanical polishing pads

A chemical mechanical polishing pad, polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.

Chemical mechanical polishing pad, polishing layer analyzer and method

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Pearland, TX, United States of America

Leo H Chiang