Macronix International Co., Ltd.

Lee-Yin Lin

Teng-Hao Yeh

Chih-Wei Hu

Hang-Ting Lue

Chieh-Fang Chen

An AND type flash memory includes a memory cell array, a plurality of page buffers and a plurality of voltage shifting circuits. The memory cell array is coupled to a plurality of bits lines and source lines. The page buffers are respectively coupled to the bit lines through a plurality of switches, and respectively provides a plurality of control signals. The control signals are transited between a first voltage and a reference voltage. The voltage shifting circuits respectively receive the control signals, generates a plurality of driving signals by shifting voltage values of the control signals, and provides the driving signals to the bit lines. Wherein, the driving signals are transited between a second voltage and the reference voltage, the second voltage is larger than the first voltage.

AND type flash memory

A memory device comprises a plurality of stacks of word lines, the word lines in the stacks having first vertical sides and second vertical sides opposite the first vertical sides, and a first plurality of strings and a second plurality of strings disposed respectively on the first vertical sides and the second vertical sides of the word lines in a particular stack in the plurality of stacks. The second plurality of strings is offset from the first plurality of strings in a direction along which the word lines in the particular stack extend. A first program operation includes applying a shielding voltage to a first string in the first plurality of strings and a fourth string in the second plurality of strings, and applying a program voltage to a second string in the second plurality of strings and a third string in the first plurality of strings.

Program scheme in 3D NAND flash memory

The area consumed by switching transistors for a 3D NAND memory array can be reduced with 3D voltage switching transistors with reduced aggregate area in comparison with 2D voltage switching transistors such as transistors in the substrate. The integrated circuit comprises a 3D NAND array of memory transistors; a plurality of bit lines, with different ones of the plurality of bit lines electrically coupled to different parts of the 3D NAND array; and a plurality of transistor pairs with a stack of semiconductor layers. Different layers in the stack of semiconductor layers include different transistor pairs of the plurality of transistor pairs. Each of the plurality of transistor pairs includes first and second transistors with first, second, and third source/drain terminals. The first transistor includes the first and the third source/drain terminals, and the second transistor includes the second and the third source/drain terminals. The first source/drain terminal is electrically coupled to an erase voltage line. The second source/drain terminal is electrically coupled to a corresponding one of a plurality of program/read voltage lines. The third source/drain terminal is electrically coupled to a corresponding one of the plurality of bit lines.

3D voltage switching transistors for 3D vertical gate memory array

A device, such as an integrated circuit including memory, includes an array of memory cells on a substrate. A row/column line, such as a local word line or local bit line, is disposed in the array. The row/column line includes a pass transistor structure comprising a semiconductor strip in a first patterned layer over the substrate. The semiconductor strip includes a semiconductor channel body, a contact region on one side of the semiconductor channel body, and an extension on another side of the semiconductor channel body, which reaches into the memory cells in the array. A select line in a second patterned layer crossing the semiconductor channel body is provided. The pass transistor structure can be implemented in a fanout structure for row/column lines in the array.

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Lee-Yin Lin