Akrion, LLC

Lawrence J Myland

An apparatus and method for drying substrates. The inventive apparatus comprises: an object support member for supporting at least one substrate in a process tank having one or more support sections comprising capillary material. The inventive method is a method of removing liquid from a wet substrate in a process tank comprising contacting the wet substrate with capillary material. In another aspect, the invention is a method of drying at least one substrate having a surface in a process tank comprising: submerging the substrate in a liquid having a liquid level; supporting the submerged substrates in the process tank; supplying a drying vapor above the liquid level; lowering the liquid level or raising the substrate so that the liquid level is below the substrate, thereby removing a major portion of liquid from the substrate surface; and removing remaining liquid from the substrate surface with capillary material.

Capillary drying of substrates

Drying semiconductor wafers or substrates by introducing an polar organic compound in liquid form into or onto means for enhancing evaporation within a process chamber and allowing the liquid to evaporate and form a drying vapor within the process chamber.

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West Chester, PA, United States of America

Lawrence J Myland