Nxp B.v.

Nxp Usa, Inc.

Laurent Segarra

Ronghua Zhu

Pierre Turpin

Maarten Jacobus Swanenberg

Philippe Goyhenetche

Matthew Bacchi

Simon Bertrand

Keith Jackoski

Russell Schaller

A testing method and apparatus is disclosed for testing an integrated circuit device () which has a dedicated ground bias pad () connected across a high voltage electrostatic discharge clamp circuit () to a well-driving ground pad () by applying a first voltage to the dedicated ground bias pad to bias a wafer substrate () while simultaneously applying a second voltage to the well-driving ground pad to bias the well region (), where the first and second voltage create a stressing voltage across a buried insulator layer () in the integrated circuit device so that a screening test can be conducted to screen for a defect () in the buried insulator layer by measuring a leakage current.

Screening method and apparatus for detecting deep trench isolation and SOI defects

A CAN module comprising a bit duration compensation component arranged to generate a compensated transmit command signal for controlling the driver component to drive a dominant state on the CAN bus. The compensated transmit command signal comprises dominant bits of a compensated-bit duration Tcp=TTx+tc, wherein tc comprises a compensation offset derived at least partly from a difference between a transmit-bit duration of a digital transmit command signal and a receive-bit duration of a received data signal.

Can module and method therefor

Growing community of inventors

Tournefeuille, France

Laurent Segarra