Applied Komatsu Technology, Inc.

Larry Chang

John M White

Emanuel Beer

The present invention generally provides a system and method for supporting a substrate having a support frame that minimizes deflection encountered during thermal expansion in a processing chamber. In one embodiment, the support frame comprises one or more longitudinal members coupled to one or more transverse members. The transverse members preferably define a supporting surface on which a heated susceptor is mounted. The longitudinal member is preferably disposed below the heated susceptor, thus minimizing thermal expansion of the longitudinal member. Spacers made of thermally conductive material may be disposed at appropriate locations along the members to provide more uniform distribution of heat within the members.

Support frame for substrates

A heated substrate support plate for use in a process chamber. The support plate has grooves disposed therein for receiving heating elements. The heating elements are comprised of an outer sheath, a heater coil and a heat-conducting filler material. The heating element is disposed within a groove and compressed to compact the heat-conducting filler material about the heater coil.

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Los Altos, CA, United States of America

Larry Chang