Tokyo Electron Limited

Kyungho Park

Wataru Okase

Takenobu Matsuo

Hiroshi Sato

Yoshinori Marumo

Yoshinori Kato

Yasushi Yagi

Hiroki Taniyama

Satoshi Nakashima

Takayuki Niuya

Yoshitsugu Tanaka

Yoshiyuki Harima

Michihiro Ono

Hideto Goto

Tameyasu Hyakuzuka

Jun Yamauchi

Katsusuke Shimizu

A contact is disposed to come into contact with a metal layer formed on a substrate being treated, the contact being in contact with a surface being treated from an opposite surface through a through hole present in a substrate. Alternatively, a contact is disposed to come into contact with a metal layer formed on a substrate, the contact coming into contact at an approximate center of the substrate. Alternatively, a plurality of needle bodies are disposed to be in electrical contact with a metal layer of a substrate being treated, thereby power supply for electrolytic polishing/plating to a substrate being treated being implemented, without restricting to a periphery of a substrate, from a plurality of points on a surface thereof. Due to any one of these, liquid treatment equipment enables to improve uniformity in plane of an electric current sent to a surface being treated and of liquid treatment.

Liquid treatment method using alternating electrical contacts

Providing liquid treatment equipment capable of largely reducing a frequency of discarding a treatment solution as a whole and capable of implementing smooth and high quality liquid treatment with less manufacturing burden. Equipment comprises a treatment solution bath capable of accommodating a treatment solution for implementing liquid treatment to a substrate to treat, a treatment solution circulating system circulating the accommodated treatment solution between the outside of the treatment solution bath, and a product removal unit removing a reaction product due to the liquid treatment contained in the circulated treatment solution. By circulating the accommodated treatment solution between the outside of the treatment solution bath, reaction products contained in the circulated treatment solution are removed by means of the product removal unit. Thereby, a chemical change substance and a decomposition product remaining in a treatment solution can be removed, resulting in preventing a treatment solution from deteriorating.

Liquid treatment equipment, liquid treatment method, semiconductor device manufacturing method, and semiconductor device manufacturing equipment

Liquid treatment units are disposed in multi-tiers surrounding a main-arm . Among liquid treatment units, plating units M through M are disposed on a lower tier side, and a unit for post-treatment process such as a cleaning unit where a cleaner atmosphere is necessary is disposed on an upper tier side. Thereby, an improvement in an area efficiency and the formation and maintenance of a clean atmosphere can be simultaneously obtained.

Liquid treatment system and liquid treatment method

The object of the present invention is to provide a plating method capable of planarization process of high quality in comparison with the conventional plating method and also provide a plating device and a plating system adopting the plating method of the invention. In the plating method and device, an object to be processed and an electrode plate are dipped in a solution including objective metal ions and a forward current is supplied between the object and the electrode plate to educe a metal on the surface of the object. After forming a plating film on the object excessively, a backward current is supplied between the object and the electrode to uniformly remove at least part of superfluous plating film.

Method of forming a plated layer to a predetermined thickness

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Kawasaki, Japan

Kyungho Park