Hitachi, Ltd.

Kyoko Minowa

Shigeru Matsui

Kazuo Takeda

Makoto Ohkura

Muneo Maeshima

Hirofumi Shimizu

Yasushi Matsuda

Seiichi Isomae

A defect assessing apparatus and method and a semiconductor manufacturing method for revealing the relationship between the size and depth of defects is disclosed. A detecting optical system is provided for detecting the intensity of scattered light from a defect generated by the shorter wavelength one of the light rays of at least two different wavelengths emitted from irradiating optical systems and that of scattered light from the defect generated by the longer wavelength one of same. A calculating means is provided for determining, from the scattered light intensity derived from the shorter wavelength ray and that derived form the longer wavelength ray, both detected by the detecting optical system, a value corresponding to the defect size and another value corresponding to the defect depth. A display means is provided for displaying a distribution revealing the relationship between defect size and defect depth on the basis of the value corresponding to the defect size and the value corresponding to the defect depth, both determined by the calculating means.

Defect assessing apparatus and method, and semiconductor manufacturing method

Growing community of inventors

Kokubunji, Japan

Kyoko Minowa