Taiwan Semiconductor Manufacturing Comp. Ltd.

Kuoyuan (Peter) Hsu

Derek C Tao

Bing Wang

Sung-Chieh Lin

Jacklyn Chang

Yukit Tang

Young Suk Kim

Young Seog Kim

Annie-Li-Keow Lum

Wei-Li Liao

David Yen

Jiann-Tseng Huang

Kai Fan

Subramani Kengeri

Po-Hung Chen

Chen-Ming Hung

Dong Sik Jeong

Sungchieh Lin

Yun-Han Chen

Chan-Hong Chern

Fu-Lung Hsueh

Ming-Chieh Huang

Yen-Chieh Huang

Yong Zhang

Chin-Huang Wang

Allen Fan

Chi-Hsu Chiu

Dongsik Jeong

Evan Yong Zhang

We-Li Liao

Maofeng Len

A memory circuit includes: memory cells each including a storage transistor corresponding to a predetermined configuration; and a tracking circuit configured to elapse a variable waiting period during which a voltage on a first node decreases from a first level to a second level, the tracking circuit including a first finger circuit coupled between a first node of a tracking bit line and a reference voltage node, the first finger circuit including a first set of first tracking cells, each first tracking cell including a first shadow transistor corresponding to the predetermined configuration, gate terminals of the first shadow transistors being coupled with a tracking word line; and a second finger circuit coupled between the first node and the reference voltage node; and a first switch configured to adjust the variable waiting period by selectively coupling the second finger circuit in parallel with the first finger circuit.

Memory circuit including tracking circuit

Various embodiments for configurable memory storage systems are disclosed. The configurable memory storages selectively choose an operational voltage signal from among multiple operational voltage signals to dynamically control various operational parameters. For example, the configurable memory storage systems selectively choose a maximum operational voltage signal from among the multiple operational voltage signals to maximize read/write speed. As another example, the configurable memory storage systems selectively choose a minimum operational voltage signal from among the multiple operational voltage signals to minimize power consumption. Moreover, the configurable memory storage systems selectively provide the maximum operational voltage signal to bulk (B) terminals of some of their transistors to prevent latch-up of these transistors. In some situations, the configurable memory storage systems can dynamically adjust the maximum operational voltage signal to compensate for fluctuations in the maximum operational voltage signal.

Latch-up prevention circuit for memory storage system

A method includes placing first and second oxide diffusion (OD) layout patterns in a layout design corresponding to first, second, third, and fourth memory cells of a memory circuit. The first OD layout pattern extends along a first direction and has a first source portion shared between the first and second memory cells, and the second OD layout pattern extends along the first direction and has a second source portion shared between the third and fourth memory cells. The method includes placing a first conductive layout pattern in the layout diagram, the first conductive layout pattern corresponding to a first conductive structure under a lowest via plug layer of the memory circuit, extending along a second direction, and overlapping the first source portion and the second source portion. The method is wholly or partially performed by using a hardware processor.

Memory circuit layout method

A memory circuit includes: memory cells each including a storage transistor having a first configuration; and a tracking circuit including: a tracking bit line having first and second intermediary nodes; a tracking word line; a first finger circuit (coupled between the first intermediary node and a reference voltage node) including: a first set of first tracking cells, each including a first shadow transistor having the first configuration; and a second finger circuit (coupled between the second intermediary node and the reference voltage node) including: a second set of second tracking cells, each including a second shadow transistor having the first configuration; gate terminals of the first and second shadow transistors being coupled with the tracking word line; and a switch configured to selectively couple the first intermediary node with the second intermediary node and thereby selectively couple the first and second finger circuits in parallel.

A memory circuit including: memory cells, each including a storage cell transistor; a first tracking bit line; and a tracking circuit, electrically coupled between a first tracking word line and a reference voltage node, including a first set of first tracking cells, each first tracking cell including a first cell transistor having a same transistor configuration as each storage cell transistor; and wherein: a driving capacity of the storage cell transistors of the memory cells has a storage cell statistical distribution that exhibits a weak bit current value; a driving capacity of the first cell transistors of the first set of tracking cells has a first tracking cell statistical distribution that exhibits a first strong bit current value; and a first quantity of the first tracking cells is sufficient to cause the first strong bit current value to be equal to or less than the weak bit current value.

Memory circuit having tracking circuit including series-connected transistors

A memory circuit layout design includes first, second, third, and fourth memory cell regions abutting one another and corresponding to respective first, second, third, and fourth memory cells of the memory circuit. A first oxide diffusion (OD) layout pattern corresponds to a first active structure for forming the first and second memory cells, extends along a first direction, and has a shared source portion overlapping the first and second memory cell regions. A second OD layout pattern corresponds to a second active structure for forming the third and fourth memory cells, extends along the first direction, and has a shared source portion overlapping the third and fourth memory cell regions. A first conductive layout pattern corresponds to a first conductive structure under a lowest via plug layer of the memory circuit, extends along a second direction, and overlaps the shared source portions of the first and second OD layout patterns.

Memory circuit layout

A method of fabricating a memory array includes designing first layout sections in a row direction, each first layout section including first and second control lines in a first metal layer, and an upper conductive line in a third metal layer. A lower conductive line in a second metal layer is coupled to the first control line and the first control line is isolated from the second control line. A second layout section is inserted at every N-th first layout section, N being a positive integer equal to or greater than 2. The second layout section includes the first control line, the second control line and a lower conductive line in the second metal layer coupled to the second control line and to an upper conductive line in the third metal layer. The lower conductive lines in the first and second layout sections are isolated from each other.

Memory metal scheme

A method of operating a tracking circuit of a memory device includes charging a node of the tracking circuit to a first predetermined voltage level, the first node being electrically coupled with a first load device. A first plurality of tracking cell transistors are activated to discharge the first node toward a second predetermined voltage level. A reset signal is generated based on a signal at the first node. The reset signal may correspond to a waiting period for reading a memory cell of the memory device.

Method of operating tracking circuit

A memory device includes: memory cells arranged in rows and columns; and regulated ground circuits corresponding to the columns. Each regulated ground circuit includes: a column ground node; at least three low-side voltage sources; at least three switches, each of the at least three switches being coupled between the column ground node and a corresponding one of the at least three voltage sources; and each of the at least three switches being controlled by a corresponding one of different control signals; Each memory cell includes: a high-side voltage source; an internal ground node coupled to the column ground node; and a cross latch having output and output_bar nodes. The cross latch is coupled between the high-side voltage source and the internal ground node, and is configured to selectively connect the output and output_bar nodes to corresponding bit and bit_bar lines.

Memory with regulated ground nodes and method of retaining data therein

A method for forming an integrated circuit includes forming a deep n-well (DNW) in a substrate, and forming a PMOS transistor in the DNW. The method also includes forming an NMOS transistor in the substrate and outside the DNW, and forming a reverse-biased diode. The method further includes forming an electrical path between a drain of the PMOS transistor and a gate structure of the NMOS transistor. The dissipation device is also connected to the electrical path.

Integrated circuit structure

A memory circuit includes a plurality of memory cells and a tracking circuit. Each memory cell of the plurality of memory cells includes a cell transistor corresponding to a predetermined transistor configuration. The tracking circuit includes a first tracking bit line, a first tracking word line, a reference voltage node, and a first plurality of tracking cells. Each tracking cell of the first plurality of tracking cells includes a cell transistor corresponding to the predetermined transistor configuration. The cell transistors of the first plurality of tracking cells are electrically coupled in series between the first tracking bit line and the reference voltage node, and gate terminals of the cell transistors of the first plurality of tracking cells are electrically coupled with the first tracking word line.

A memory circuit includes a first active structure extending along a first direction, a second active structure extending along the first direction, a first conductive structure extending along a second direction, and a lowest via plug layer over the first conductive structure. The first active structure has a shared source portion corresponding to a source node of a first memory cell of the memory circuit and a source node of a second memory cell of the memory circuit. The second active structure has a shared source portion corresponding to a source node of a third memory cell of the memory circuit and a source node of a fourth memory cell of the memory circuit. The first conductive structure electrically connects the shared source portion of the first active structure with the shared source portion of the second active structure.

Memory circuit, layout of memory circuit, and method of forming layout

A method of fabricating a memory includes forming a first portion of a first line in a first metal layer, forming a first portion of a second line in the first metal layer, forming a second portion of the first line in a second metal layer, and forming a second portion of the second line in a third metal layer. The first line is over a plurality of memory cells. The second line is over the plurality of memory cells, the first line is electrically isolated from the second line, and the first line and the second line extend in a same direction. The second metal layer is over the first metal layer. The third metal layer is over the second metal layer and the third metal layer is electrically isolated from the first line.

A circuit includes a first latch for generating a first latched signal; and a first comparator for comparing the first latched signal and a write address, and generating a first comparator signal. The circuit includes a first logic circuit for receiving the first comparator signal and a fourth latched signal, and generating a first logic circuit output signal; and a second latch for receiving the first logic circuit output signal and generating a second latched signal. The circuit includes a third latch for generating a third latched signal; and a second comparator for comparing the third latched signal and a read address, and generating a second comparator signal. The circuit includes a second logic circuit for receiving the second comparator signal and the second latched signal, and generating a second logic circuit signal; and a fourth latch for receiving the second logic circuit signal and generating the fourth latched signal.

Growing community of inventors

San Jose, CA, United States of America

Kuoyuan (Peter) Hsu