Taiwan Semiconductor Manufacturing Comp. Ltd.

Kuo-Wei Cheng

Jing-Cheng Lin

Shau-Lin Shue

Ming-Hsing Tsai

Hung-Wen Su

Hsien-Ming Lee

Shing-Chyang Pan

Ting-Chu Ko

Shih-Wei Chou

A method of electrochemical deposition (ECD) provides a barrier and a seed layer on a substrate. The surfaces of the substrate are pre-treated before a metal layer is electrochemically deposited thereon in an electrochemical plating cell with a physical or a chemical surface treatment process. The electrochemical plating cell is covered by a cap to prevent evaporation of the electrolyte solution. The electrochemical plating cell includes a substrate holder assembly with a lift seal, e.g., with a contact angle &#x3b8; less than 90&#xb0; between the lift seal and the substrate. The substrate holder assembly includes a substrate chuck at the rear side of the substrate.

Method and apparatus for fabricating metal layer

Growing community of inventors

Tainan, Taiwan

Kuo-Wei Cheng