Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Albert-ludwigs-universitat Freiburg

Kuno Mayer

Daniel Kray

Daniel Biro

Ralf Preu

Andreas Grohe

Stefan Glunz

Ansgar Mette

Filip Granek

Jochen Rentsch

Martin Zimmer

Mark Schumann

Elias Kirchgässner

Eva Zimmer

Arpad Mihai Rostas

Teresa Orellana Peres

Monica Aleman

A liquid agent for the surface treatment of monocrystalline wafers, which contains an alkaline etching agent and also at least one low-volatile organic compound. Systems of this type can be used both for the cleaning, damage etch and texturing of wafer surfaces in a single etching step and exclusively for the texturing of silicon wafers with different surface quality, whether it now be wire-sawn wafers with high surface damage or chemically polished surfaces with minimum damage density.

Texturing and cleaning agent for the surface treatment of wafers and use thereof

The invention relates to a method for the precision processing of substrates, in particular for the microstructuring of thin layers, local dopant introduction and also local application of a metal nucleation layer in which a liquid-assisted laser, i.e. laser irradiation of a substrate which is covered in the regions to be processed by a suitable reactive liquid, is implemented.

Method for the precision processing of substrates

Growing community of inventors

Frankfurt/Main, Germany

Kuno Mayer