Tokyo Shibaura Denki Kabushiki Kaisha

Kunihiro Ikari

Norio Koike

Kazuhiro Takeda

Yasuhiro Shirakawa

Takeo Ito

Takeshi Takahara

Hideo Honma

Osamu Sasaki

Tsutomu Takamura

Shingo Watanabe

Katsuhiro Takahashi

Toshiki Sasabe

Photoresist compositions based upon a water-soluble polymer are disclosed together with a water-soluble bisazide compound as a cross-linker, a water-soluble adhesion-improving diazo compound are characterized in that a water-soluble silane compound is included. The compositions are photosensitive, particularly to ultraviolet rays, and adhere well to the substrates to which they are applied. The compositions of the invention are used as photoresists.

Water soluble photoresist composition with bisazide, diazo, polymer and

There are disclosed a composition for making a picture tube fluorescent screen characterized by essentially consisting of a light-sensitive resin at least having recurring units (1) and (2) represented by the formulas: ##STR1## wherein R and X.sup.- have the same meanings as defined in the specification, and CaS-based phosphor particles which are dispersed in an aqueous medium, and a method of making a picture tube fluorescent screen using the same. According to this invention, it is possible to make a picture tube exhibiting an excellent light emitting efficiency and a contrast by a simple process.

Method of making picture tube fluorescent screen

There are disclosed a composition for making a picture tube fluorescent screen characterized by essentially consisting of a light-sensitive resin at least having recurring units (1) and (2) represented by the formulas: ##STR1## wherein R and X.sup.- have the same meanings as defined in the specification, and CaS-based phosphor particles surface-coated with SiO.sub.2 which are dispersed in an aqueous medium, and a method of making a picture tube fluorescent screen using the same. According to this invention, it is possible to make a picture tube exhibiting an excellent light emitting efficiency and a contrast by a simple process.

There is presented a chemical copper-plating bath capable of providing a plated film having excellent mechanical characteristics, especially ductility, which bath contains a specific additive having the following formula: ##STR1## Stability of the bath as well as further improvement of mechanical strength of plated films are also found to be attained by adding in combination at least one compound selected from the group consisting of 1,10-phenanthroline, its derivatives, 2,2'-dipyridyl, 2,2'-diquinoline and water-soluble cyanides.

Chemical copper-plating bath

A printed circuit is formed by a coating the entire region of at least one main surface of an insulating substrate with a resin type adhesive layer containing a solid solution consisting of titanium oxide, nickel oxide and antimony oxide, followed by selectively forming a mask on the adhesive layer to provide the non-masked region as a circuit-forming region. Further, the circuit-forming region is treated with a solution of an oxidizing agent and, then, subjected to an activation treatment. Finally, the mask is removed and a desired conductive layer pattern is formed on the activated surface region by means of electroless plating.

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Yokosuka, Japan

Kunihiro Ikari