Nihon Shinku Gijutsu Kabushiki Kaisha

Kuniaki Nakajima

Tomoyasu Kondo

Yasushi Higuchi

Tsuyoshi Sahoda

Takashi Komatsu

Toshimitsu Uehigashi

A sputtering device that efficiently guides sputtering particles ejected from a target to a film deposition subject and prolongs the interval at which a stick preventive member requires replacement. The sputtering device has a vacuum chamber in which a specified sputtering target is placed so as to face a substrate that is also placed in the vacuum chamber , and deposits a film on a surface of the substrate using sputtering particles ejected from the sputtering target ; and particle ejection sections constructed so as to slope at a specified angle of 30&deg; to 60&deg; with respect to the surface of the substrate , and respectively facing each other in the shape of a funnel are provided on the sputtering target . Lines of magnetic force run from an N pole of a magnet arranged at a rear surface of the target to an S pole of a magnet arranged around the target

Sputtering device

A sputtering device enabling a small incident angle. A plurality of shield plates provided with holes at the same positions as targets are arranged in a vacuum chamber. Sputtering particles ejected diagonally from the targets,become attached to the shield plates,and only particles ejected vertically reach the surface of a substrate,As a result, it is possible to uniformly form a thin film inside microscopic holes of high aspect ratio. If sputtering gas is introduced close to the targets,, reactant gas is introduced close to the substrate,and evacuation carried out close to the substrate,reactant gas does not reach the targets,side. Consequently, it is possible to prevent deterioration of the surfaces of the targets,.

Growing community of inventors

Susono, Japan

Kuniaki Nakajima