K. C. Tech Co., Ltd.

Kun Hee Park

Yong Ho Jeong

Young Gon Kim

Ga Young Jung

Young Ho Yun

Kyong Jin Jung

Young Ho Yoon

Young Lok Yoon

A composition for dissolving abrasive particles, and a cleaning method using the composition are provided. The composition includes a sulfur-containing organic acid, a fluorine ion-containing compound, and a solvent, and a turbidity change rate (%) measured at 60° C. for 15 minutes may be in a range of −80 to −99.

Composition for dissolving abrasive particles and cleaning method using the same

The present disclosure relates to a cleaning liquid composition and a cleaning method using the same. A polishing slurry composition according to an embodiment of the present disclosure includes: a chelating agent containing an organic salt; and an anionic surfactant.

Cleaning liquid composition and cleaning method using same

A cleaning solution composition and a cleaning method using the cleaning solution composition are provided. The cleaning solution composition includes a chelating agent including a first organic acid and a second organic acid, and an etching agent including a fluoride compound.

Cleaning solution composition and cleaning method using the same

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Gyeonggi-do, South Korea

Kun Hee Park