Cheil Industries Inc.

Samsung Sdi Co., Inc.

Kun-Bae Noh

Sang-Soo Kim

Jong-Hwa Lee

Ji-Yun Kwon

Eun-Ha Hwang

Jin-Young Lee

Dae-Yun Kim

Eun-Bi Park

Sang-Kyeon Kim

Jin-Hee Kang

Bum-Jin Lee

Jae-Yeol Baek

Jun-Ho Lee

Sang-Kyun Kim

Hyun-Yong Cho

Eun-Kyung Yoon

Chung-Beom Hong

Jae-Hwan Song

Sang-Haeng Lee

Yong-Tae Kim

Eun-Kyoung Youn

Chung-Beum Hong

In-Chul Hwang

Hwan-Sung Cheon

Jin-Hee Bae

Woo-Han Kim

Taek-Soo Kwak

Il Yong Jung

Sang-Ran Koh

Hui-Chan Yun

Jun-Young Jang

Yoong-Hee Na

Byeong-Gyu Hwang

Bo-Sun Kim

Eun-Seon Lee

Wan-Hee Lim

Sae-Mi Park

Jun Sakong

Jin-Gyo Kim

A composition for forming a silica layer including a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 70,000 and a polydispersity index of about 5.0 to about 17.0 and a solvent; a silica layer manufactured using the same; and an electronic device including the silica layer.

Composition for forming silica layer, silica layer, and electronic device

Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a first dissolution-controlling agent including at least one of compounds represented by the following Chemical Formula 1 or Chemical Formula 2; (D) a second dissolution-controlling agent including a compound represented by the following Chemical Formula 3; and (E) a solvent, and a photosensitive resin film and a display device using the same.

Positive photosensitive resin composition, and photosensitive resin film and display device prepared by using the same

Disclosed is a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a cross-linking agent; (D) a thermal acid generator; (E) a phenol compound; and (F) an organic solvent, wherein the cross-linking agent and thermal acid generator are included in a weight ratio of about 1:50 to about 50:1.

Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device

Disclosed are a photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a phenol compound; (D) a thermal acid generator; and (E) a solvent, wherein the solvent includes an organic solvent having a boiling point of less than about 160&#xb0; C. under an atmospheric pressure and an organic solvent having a boiling point of greater than or equal to about 160&#xb0; C. under an atmospheric pressure, wherein the organic solvent having a boiling point of less than about 160&#xb0; C. is included in an amount of greater than or equal to about 90 wt % and less than about 100 wt % based on the total amount of the solvent, and the organic solvent having a boiling point of greater than or equal to about 160&#xb0; C. is included in an amount of greater than about 0 wt % and less than or equal to about 10 wt % based on the total amount of the solvent, a photosensitive resin film using the same, and a display device.

A photosensitive resin composition for an insulating film of a display device includes (A) an alkali soluble resin including a polybenzoxazole precursor, polyamic acid, polyimide, or a combination thereof; (B) a photosensitive diazoquinone compound; (C) an ultraviolet (UV) absorber having a maximum absorption wavelength of about 300 to about 400 nm; and (D) a solvent. An insulating film and a display device can include the photosensitive resin composition.

Photosensitive resin composition for insulating film of display device, insulating film using the same, and display device using the same

Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) at least one organic dye having an absorption wavelength of about 400 nm to about 700 nm, and (E) a solvent, wherein the organic dye (D) is included in an amount of about 1 to about 40 parts by weight based on about 100 parts by weight of the alkali soluble resin (A), and a photosensitive resin layer and a display device using the same.

Positive photosensitive resin composition, and photosensitive resin layer and display device using the same

Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a compound represented by the following Chemical Formula 1, and (D) a solvent, and a display device and an organic light emitting device using the same.  The Chemical Formula 1 is the same as defined in the detailed description.

Positive photosensitive resin composition, and display device and organic light emitting device using the same

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Uiwang-si, South Korea

Kun-Bae Noh