Spin Memory, Inc.

Crossbar, Inc.

Integrated Silicon Solution, (cayman) Inc.

University of Michigan

Spin Transfer Technologies, Inc.

Kuk-Hwan Kim

Amitay Levi

Dafna Beery

Andrew J Walker

Sung Hyun Jo

Gian Sharma

Marcin Gajek

Kadriye Deniz Bozdag

Eric Ryan

Wei Lu

Neal Berger

Michail Tzoufras

TaeJin Pyon

Tanmay Kumar

Satoru Araki

Susmita Karmakar

Andy Walker

Hagop A Nazarian

Benjamin S Louie

Joanna Bettinger

Ping Lu

Chen-Chun Chen

Steven Patrick Maxwell

Peter P Cuevas

Girish Jagtiani

Amity Levi

A method for manufacturing a magnetic random access memory array incudes forming a source region within a surface of a substrate, forming an array of three-dimensional (3D) structures over the substrate, each 3D structure being separated from an adjacent 3D structure by a cavity region, depositing a channel material on a surface of at least one sidewall of each 3D structure, depositing a gate dielectric material over the channel material on the surface of the at least one sidewall of each 3D structure, forming a first isolation region in each cavity region between adjacent 3D structures over the substrate, and forming a first gate region over the first isolation region in each cavity region.

Three dimensional perpendicular magnetic tunnel junction with thin film transistor array

Aspects of the present technology are directed toward Integrated Circuits (IC) including a plurality of trenches disposed in a substrate about a set of silicide regions. The trenches can extend down into the substrate below the set of silicide regions. The silicide regions can be formed by implanting metal ions into portions of a substrate exposed by a mask layer with narrow pitch openings. The trenches can be formed by selectively etching the substrate utilizing the set of silicide regions as a trench mask. An semiconductor material with various degree of crystallinity can be grown from the silicide regions, in openings that extend through subsequently formed layers down to the silicide regions.

Patterned silicide structures and methods of manufacture

A memory device for storing data comprises a memory bank comprising a plurality of addressable memory cells, wherein the memory bank is divided into a plurality of segments. The memory device also comprises a cache memory operable for storing a second plurality of data words, wherein further each data word of the second plurality of data words is either awaiting write verification or is to be re-written into the memory bank. The cache memory is divided into a plurality of primary segments, wherein each primary segment of the cache memory is direct mapped to a corresponding segment of the plurality of segments of the memory bank, wherein each primary segment of the plurality of primary segments of the cache memory is sub-divided into a plurality of secondary segments, and each of the plurality of secondary segments comprises at least one counter for tracking a number of valid entries stored therein.

Error cache system with coarse and fine segments for power optimization

A memory device comprises a memory bank comprising a plurality of addressable memory cells, wherein the memory bank is divided into a plurality of segments. Further, the device comprises a cache memory operable for storing a second plurality of data words, wherein each data word of the second plurality of data words is either awaiting write verification associated with the memory bank or is to be re-written into the memory bank. The cache memory is divided into a plurality of primary segments, wherein each primary segment of the cache memory is direct mapped to a corresponding segment of the plurality of segments, wherein each primary segment is sub-divided into a plurality of secondary segments, and wherein each of the plurality of secondary segments comprises at least one counter for tracking a number of entries stored therein.

Heuristics for selecting subsegments for entry in and entry out operations in an error cache system with coarse and fine grain segments

A three dimensional magnetic random access memory array that includes a sourceline formed on a substrate and a magnetic memory element pillar that includes a plurality of magnetic memory element pillars formed over the substrate. The three dimensional magnetic random access memory array also includes a transistor formed between the magnetic memory element pillar, the transistor being functional to electrically connect the sourceline and magnetic memory element pillar. A plurality of magnetic memory element pillars may be formed over the substrate with a transistor between each memory element pillar to selectively connect or disconnect each of the magnetic memory element pillars. The transistor can include an epitaxial semiconductor structure having a gate dielectric formed at a side of the epitaxial semiconductor and a gate material formed on the gat dielectric such that the gate dielectric material is between the gate material and the semiconductor material.

In accordance with one embodiment, a method includes forming a cleavable donor substrate, the substrate including monocrystalline Si, forming a dielectric layer above the substrate in a film thickness direction, and cleaving the substrate into an upper portion having the dielectric layer and a lower portion. In one embodiment, the cleavable substrate is formed using a sacrificial buffer layer above the substrate in the film thickness direction, and forming a strained Si layer above the sacrificial buffer layer in the film thickness direction, followed by etching away the sacrificial buffer layer to cleave the substrate. In another embodiment, the cleavable substrate is formed by implanting ions into the substrate to a peak implant position located below an upper surface of the substrate, annealing the substrate and dielectric layer in an inert environment to form blisters at the peak implant position, and cleaving the substrate using the blisters.

High density 3D magnetic random access memory (MRAM) cell integration using wafer cut and transfer

A transistor structure, according to one embodiment, includes: an epitaxially grown vertical channel, a word line which surrounds a middle portion of the vertical channel, and a p-MTJ sensor coupled to a first end of the vertical channel. The second side of the vertical channel is opposite the first side of the vertical channel along a plane perpendicular to a deposition direction. A magnetic device, according to another embodiment, includes: a plurality of transistor structures, each of the transistor structures comprising: an epitaxially grown vertical channel, a word line which surrounds a middle portion of the vertical channel, and a p-MTJ sensor coupled to a first end of the vertical channel.

Perpendicular magnetic tunnel junction memory cells having vertical channels

A method for manufacturing an array of magnetic memory elements, wherein first memory element types are formed in a first region and second type of magnetic memory element types are formed in a second region. A shadow-mask is used during deposition to limit the deposition of at least one layer of memory element material to only the second region wherein the second memory element types are to be formed. The method can include depositing full film magnetic memory element layers over an entire substrate and then using the shadow-mask to deposit at least one performance altering material in the second memory element region. Alternatively, a first shadow-mask can be used to deposit a series of first memory element layers in a first region, and a second shadow-mask can be used to deposit a plurality of second memory element layers in a second region.

Method for manufacturing a data recording system utilizing heterogeneous magnetic tunnel junction types in a single chip

A method for crystalized silicon structures from amorphous structures in a magnetic memory array, wherein the temperature needed to crystalize the amorphous silicon is lower than the temperature budget of the memory element so as to avoid damage to the memory element. An amorphous silicon is deposited, followed by a layer of Ti or Co. An annealing process is then performed which causes the Ti or Co to form TiSior CoSiand also causes the underlying amorphous silicon to crystallize.

High density MRAM integration

According to one embodiment, a method includes forming a first insulative layer above a bottom surface of a groove and along inner sidewalls thereof, forming a source line layer within the groove of the substrate, forming a first dielectric layer on outer sides of a middle portion of the source line layer, forming a buffer layer on outer sides of the first dielectric layer, forming a gate terminal above the source line layer, forming a gate dielectric layer between the source line layer and the gate terminal and on outer sides of the lower portion of the gate terminal, forming a drain terminal including strained Si on outer sides of the first dielectric layer, and forming a relaxed buffer layer on outer sides of the upper portion of the source line layer and outer sides of the drain terminal, with the gate terminal extending beyond the relaxed buffer layer thickness.

Vertically-strained silicon device for use with a perpendicular magnetic tunnel junction (PMTJ)

The various implementations described herein include methods, devices, and systems for performing operations on memory devices. In one aspect, a memory device a magnetic memory component and a current selector component coupled to the magnetic memory component. The current selector component includes a first transistor having a first gate with a corresponding first threshold voltage. The first transistor comprises a charge storage layer configured to selectively store charge so as to adjust a current through the first transistor. The memory device further includes control circuitry configured to determine a bit error rate of the magnetic memory component and adjust a charge stored in the charge storage layer based on the determined bit error rate.

Adjustable current selectors

A magnetic memory device that includes magnetic read elements and magnetic reference cells. The magnetic reference cells include magnetic tunnel junction elements having the same construction as the magnetic read elements. The reference cells produce a reference signal that can be compared with a read signal from the magnetic read element to determine whether the read element is in a high or low resistance state. During creation of the reference signal, the current passes in such a way so that reference cells are forced to be in the right state while causing no disturbance to the reference cell. The reference cell includes magnetic tunnel junction elements and also includes circuitry configured to produce a magnetic field that biases the magnetic tunnel junction elements of the reference cell into a desired magnetic state to ensure that the desired magnetic state of the reference cell magnetic tunnel junction elements is maintained.

Growing community of inventors

San Jose, CA, United States of America

Kuk-Hwan Kim