Taiwan Semiconductor Manufacturing Comp. Ltd.

Ku-Hsiang Sung

Hsin-Chang Lee

Chia-Jen Chen

Kuan-Wen Lin

Chen-Yang Lin

Chung-Hsuan Liu

Da-Wei Yu

In a method of manufacturing a semiconductor device a semiconductor wafer is retrieved from a load port. The semiconductor wafer is transferred to a treatment device. In the treatment device, the surface of the semiconductor wafer is exposed to a directional stream of plasma wind to clean a particle from the surface of the semiconductor wafer. The stream of plasma wind is generated by an ambient plasma generator and is directed at an oblique angle with respect to a perpendicular plane to the surface of the semiconductor wafer for a predetermined plasma exposure time. After the cleaning, a photo resist layer is disposed on the semiconductor wafer.

Method and device for cleaning substrates

A wafer cleaning module and a method for cleaning a wafer with the wafer cleaning module are disclosed. For example, the wafer cleaning module includes a wafer chuck to hold a wafer, an ozone source to provide ozone gas towards the wafer, and an ultraviolet (UV) lamp module to provide UV light. The UV lamp module includes a UV light source and a rotatable reflector around the UV light source. The rotatable reflector is movable to adjust an amount of UV light directed towards a surface of the wafer.

Ozone wafer cleaning module having an ultraviolet lamp module with rotatable reflectors

Growing community of inventors

Taoyuan, Taiwan

Ku-Hsiang Sung