Sii Nanotechnology Inc.

Seiko Instruments Inc

Aoi Electronics Co., Ltd.

Other

Kouji Iwasaki

Toshiaki Fujii

Yasuhiko Sugiyama

Yo Yamamoto

Yutaka Ikku

Junichi Tashiro

Masakatsu Hasuda

Toshio Kodama

Yasuyuki Takagi

Xin Man

Takashi Kaito

Haruo Takahashi

Tatsuya Adachi

Masanao Munekane

Hiroki Hayashi

Takashi Konno

Takashi Ogawa

Tatsuya Asahata

Masatoshi Yasutake

Takahiro Ochiya

Kazuo Aita

Yoshihiro Koyama

Masamichi Oi

Hiroyuki Wada

Takumi Teratani

Yusuke Yamamoto

Masanso Munekane

Toshiaki Fuji

Small tweezers having a pair of arms openable and closable is moved closer to a sample and grips a particle attached on a surface of the sample and carries it onto an adhesion member to attach it thereto. The small tweezers are opened to release the particle and brought away from the adhesion member to leave the particle on the adhesion member. A particle removing device includes small tweezers having a pair of arms openable and closable; an opening/closing driving unit that drives the arm or arms to open/close the small tweezers; a stage mounting an adhesion member that attaches thereto a particle to withdraw the particle; and a moving mechanism that moves the small tweezers between the sample and the adhesion member mounted on the stage. Also, an atomic force microscope and a charged ion beam apparatus that include the particle removing device are disclosed.

Particle removing method, particle removing device, atomic force microscope, and charged particle beam apparatus

A focused ion beam system includes a sample holder having a fixing plane for fixing a sample, a sample base on which the sample holder is provided, a focused ion beam irradiating mechanism that irradiates a focused ion beam to the sample, microtweezers that hold the sample and have the axial direction at a predetermined angle to a surface of the sample base, an opening/closing mechanism that opens and closes the microtweezers, a rotating mechanism that rotates the microtweezers about the axial direction, and a moving mechanism that moves the position of the microtweezers.

Focused ion beam system and sample processing method using the same

A micro cross-section processing method includes the steps of determining a linear cross-section estimated position including an observation object on a surface of the sample, irradiating the focused ion beam to the cross-section estimated position perpendicularly to or at a tilt angle to form a cross-section at a position in front of the cross-section estimated position, irradiating the focused ion beam to both ends of the cross-section to form side cuts extending to a position in rear of the cross-section estimated position, irradiating the focused ion beam to a position on the surface of the cross-section and at a position deeper than the observation object to form a bottom cut extending to a position in rear of the cross-section estimated position, irradiating the focused ion beam along from the side cuts to the cross-section estimated position to form wedges connecting to the bottom cut, and applying impact to a region in front of the cross-section estimated position of the sample to cleave the vicinity of the cross-section estimated position between the wedges and form a plane of cleavage.

Micro cross-section processing method

A composite focused ion beam device has a sample stage for supporting a sample, a first ion beam irradiation system that irradiates a first ion beam for processing the sample, and a second ion beam irradiation system that irradiates a second ion beam for processing or observing the sample. The first ion beam irradiation system has a liquid metal ion source that generates first ions for forming the first ion beam. The second ion beam irradiation system has a gas field ion source that generates second ions for forming the second ion beam. The first ion beam irradiated by the first ion beam irradiation system has a first beam diameter and the second ion beam irradiated by the second ion beam irradiation system has a second beam diameter smaller than the first beam diameter. The first and second ion beam irradiation systems are disposed relative to the sample stage so that axes of the first and second ion beams are orthogonal to a tilt axis of the sample stage.

Composite focused ion beam device, and processing observation method and processing method using the same

Provided is a method of preparing a sample piece for a transmission electron microscope, the sample piece for a transmission electron microscope including a substantially planar finished surface which can be observed with the transmission electron microscope and a grabbing portion which microtweezers can grab without contacting the finished surface. The method of preparing a sample piece for a transmission electron microscope is characterized by including: a first step of cutting out the sample piece from a sample body Wa with a charged particle beam, the sample piece being coupled to the sample body at a coupling portion; a second step of grabbing with the microtweezers the grabbing portion of the sample piece with the finished surface of the sample piece cut out in the first step being covered with the microtweezers; a third step of detaching the sample piece grabbed with the microtweezers in the second step from the sample body by cutting the coupling portion with the charged particle beam with a grabbed state of the sample piece being maintained; and a fourth step of transferring and fixing with the microtweezers the sample piece detached in the third step onto a sample holder.

Method of preparing a transmission electron microscope sample and a sample piece for a transmission electron microscope

An apparatus is provided that precisely conduct ion beam etching to a sample having the properties of which easily change by electron beam irradiation with no loss of ease of operation and throughput. An apparatus includes an ion beam lens barrel and an electron beam lens barrel, which can observe or measure the conditions of a sample with an electron beam in the process of etching with an ion beam, wherein first, an observation image is obtained that includes the entire process area formed by secondary signals generated by an electron beam, secondly, an irradiation permit area and an irradiation inhibit area are defined in the observation image, and thirdly, electron beam irradiation is restricted only to the irradiation permit area.

Composite charged particle beam apparatus, method of processing a sample and method of preparing a sample for a transmission electron microscope using the same

Objects to be achieved by the invention are to provide a nanobio device in which cultured cells are organized at a high-level in a state near in vivo, and to provide a method of using the nanobio device of imitative anatomy structure. The nanobio device of imitative anatomy structure of the invention is obtained by manufacturing a substrate with a bio-compatible substance and arranging a plurality of types of cells thereon in a desired array. A method of manufacturing a nanobio device in the invention includes a step of manufacturing a substrate for a nanobio device by a micromachine processing technique and a step of arranging a plurality of cultured cells on the substrate in a desired array with laser optical tweezers.

Nanobio device of imitative anatomy structure

A focused ion beam apparatus includes a sample base for mounting a sample, a three axis stage capable of moving the sample base in three directions: along two axes on a horizontal face and a vertical axis, and a first focused ion beam barrel and a second focused ion beam barrel for irradiating the sample with focused ion beams, the first focused ion beam barrel and the second focused ion beam barrel being arranged such that directions of the focused ion beams are substantially opposed to each other in a plane view thereof and are inclined in substantial line symmetry with regard to the vertical axis in a side view thereof.

Focused ion beam apparatus and method of preparing/observing sample

To include a focused ion beam apparatus fabricating a sliced specimen by processing a specimen as well as observing the sliced specimen, a scanning electron microscope observing the slice specimen, a gas-ion beam irradiation apparatus performing finishing processing by irradiating a gas-ion beam onto a surface of the sliced specimen, a specimen stage on which the sliced specimen is fixed and having at least one or more rotation axis, a specimen posture recognition means recognizing positional relation of the sliced specimen with respect to the specimen stage and a specimen stage control means controlling the specimen stage based on a specimen posture recognized by the posture recognition means and an installation angle of the gas-ion beam irradiation apparatus in order to allow an incident angle of the gas-ion beam with respect to the obverse or the reverse of the sliced specimen to be a desired value.

Charged particle beam apparatus

A probe mechanism and a sample pick up mechanism of the invention are provided at an observing apparatus or an analyzing apparatus and characterized in including a tip member comprising a needle-like member brought into contact with a sample, including a driving electrostatic actuator and means for monitoring a change in an electrostatic capacitance between electrodes of the electrostatic actuator, and capable of sensing that the probe is brought into contact with a sample by the monitor.

Probe and small sample pick up mechanism

A sample support of the present invention is prepared such that a silicon substrate is used as a raw material, the thickness structure having a shape and a thickness of 10 &#x3bc;m or less is prepared using a semiconductor silicon process technique. The sample support of the present invention is adhered to a partially-cut mesh in a state that a sample portion is not adhered. Further, a plurality of portions where the samples are mounted is arranged on the same substrate.

Sample support prepared by semiconductor silicon process technique

An apparatus has a holder member () which holds a sample (), and a removing beam source () which irradiates an inert ion beam onto a cross section () of the sample () held by a holder member () and removes a fracture layer on the cross section (). Then, the removing beam source () is disposed on the holding end side of the sample () with respect to the normal L of the cross section () so that the irradiating direction of the inert ion beam is tilted at the tilt angle &#x3b8; to the normal L with respect to the cross section ().

Ion beam device and ion beam processing method, and holder member

There is provided a liquid metal ion beam irradiation device for irradiating a specific portion of a samplewith a prescribed liquid metal ion beam so as to form a cross section, and a gaseous ion beam irradiation devicefor scanning a prescribed region (observation region) of the cross section using a gaseous ion beam focused to a prescribed diameter and removing a damaged layer on the prescribed region.

Ion beam device and ion beam processing method

A method of fabricating a three-dimensional microstructure provides data corresponding to information relating to the structure of a three-dimensional microstructure design. A sample is processed in accordance with the provided data by irradiating the sample with a charged-particle beam while controlling processing conditions of the charged-particle beam. Dimensions of the processed sample are compared with the provided data to identify differences between the structure of the processed sample and the structure of the three-dimensional microstructure design. The sample is then irradiated again with a charged-particle beam to correct the identified structural differences while adjusting the processing conditions of the charged-particle beam to thereby fabricate a three-dimensional microstructure having a structure substantially the same as the structure of the three-dimensional microstructure design.

Method and system for fabricating three-dimensional microstructure

A micro-sample pick-up apparatus has a probe for picking up a micro sample, a probe holder for holding the probe, an XYZ driver mechanism for moving the probe holder in the three-dimensional directions of X, Y and Z, and an observation mechanism for observing the sample and the probe. A low-vibration rotary mechanism disposed in the probe holder for rotating the probe about an axis of the probe.

Growing community of inventors

Chiba, Japan

Kouji Iwasaki