Tokyo Seimitsu Co., Ltd.

Konosuke Murakami

Akira Yamaguchi

Takashi Ishimoto

Yutaka Ueda

Toshiro Mori

Yuji Shigesawa

Kazuhisa Aoki

Akira Yamamoto

Yoshio Niki

A prober includes: a wafer chuck having a conductive support surface; a movement rotation mechanism which moves and rotates the wafer chuck; a head stage which holds a probe holding portion; a stage member which has a conductive stage surface that is formed in parallel to the support surface and electrically connected with the support surface, and can move integrally with the wafer chuck; and a contactor which is fixed to a position facing the stage member and whose tip can electrically come into contact with the stage surface, wherein the stage member is separated from the wafer chuck as a separate body, and the stage surface and the support surface are electrically connected through a wiring member; and a back-surface electrode of a chip is electrically connected with a tester through the wafer chuck, a wiring, the stage member and the contactor.

Prober

The invention is a method for detecting float or peel of semiconductor chips arranged in X and Y axes directions diced and bonded to a dicing tape on a stage. The method includes detecting float or peel of the semiconductor chips in a respective horizontal or longitudinal row arranged in the X or Y axis direction; moving the stage in the X axis direction, the Y axis direction, a Z axis direction, and a rotational direction around the Z axis for aligning the stage with a position detection unit for detecting positions of the semiconductor chips in the X axis direction and the Y axis direction; detecting the positions of abnormal semiconductor chips in the respective horizontal or longitudinal row that includes said abnormal semiconductor chips; and specifying the positions of said abnormal semiconductor chips on the X-Y axes.

Chip mis-position detection method

Growing community of inventors

Tokyo, Japan

Konosuke Murakami