Agilent Technologies, Inc.

Keysight Technologies, Inc.

Koji Tokuno

Yoshimi Nagai

Tsuyoshi Tanaka

Masaharu Goto

Yuko Iwasaki

Minoru Uchida

Hideki Wakamatsu

Akihiko Goto

Yoichi Kuboyama

Atsushi Mikata

Hisao Kakitani

Shinichi Tanida

Provided are a measurement apparatus and a measurement method capable of measuring inter-terminal capacitances of a three-terminal device while reproducibility is high and influences of residual inductances are cancelled. The measurement apparatus includes: a route selector including a first terminal, a second terminal, a third terminal, a fourth terminal, a fifth terminal, and a sixth terminal, the fourth to sixth terminals being configured to connect to any of the first to third terminals; an LCR meter; a device under test, which is a three-terminal device; first, second, and third cables for respectively connecting the fourth to sixth terminals of the first route selector and first, second, and third terminals of the device under test to each other; and fourth, fifth, and sixth cables for respectively connecting the first to third terminals of the first route selector and first, second, and third terminals of the LCR meter to each other.

Inter-terminal capacitance measurement method for three-terminal device and apparatus for the same

A device analyzer for analyzing power devices. An example device analyzer comprises a collector supply to generate supply signal pulses with selected voltage or current levels and a supply signal pulse width at a high current. The supply signal pulses are applied at a collector supply source terminal when DUT is connected to conduct current between the collector supply source terminal and a collector supply common terminal. A supply switch closes or opens the DUT current path in narrow pulses having a narrow pulse width narrower than the supply signal pulses to conduct the supply signal pulses as narrowed sweep signal pulses having the high current capacity of the collector supply current. The supply switch alternatively regulates the current in the current path at constant current levels. Other modules capable of high power test capabilities may also be added.

Power device analyzer

A print circuit board includes: a first surface; a guard plane disposed on an inner layer; a high insulated region formed on the first surface of the board so as to be opposed to the guard plane, the high insulated region being substantially surrounded by one or more first guard patterns; and a quasi-high insulated region formed on the first surface of the board so as to be disposed adjacent to the high insulated region. The quasi-high insulated region is substantially surrounded by at least a part of the one or more first guard patterns and by one or more second guard patterns, in which the one or more first guard patterns and the one or more second guard patterns are each formed by forming one or more trenches in the first surface of the board so as to expose the guard plane on a bottom surface of the trenches.

Print circuit board with high insulated region, method of manufacturing thereof, and print circuit board assembly thereof

A method for finding the impedance of a device under test using an impedance measuring apparatus having a modem-type auto-balancing bridge, two or more measurement signals, each of which has a different phase with respect to the reference signals supplied to the modem inside said auto-balancing bridge, are applied to a device under test; the impedance of this device under test is measured when each of the measurement signals is applied to the device under test; and the impedance of this device under test is found using the above-mentioned phase and the impedance measurement value of each of these measurements.

Open offset canceling method and an impedance measuring apparatus using the method

An evaluation device and method for DUT boards and probe cards which increase the reproducibility of the measured values and decrease the abrasion of pads in evaluation tests. A connection box is provided with contact pins, mounting mechanisms used to mount the DUT boards, and a plurality of connectors which feed signals from the contact pins to the outside.

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Tokyo, Japan

Koji Tokuno