Hitachi-Kokusai Electric Inc.

Koichi Sada

Takayuki Nakada

Tomoyuki Matsuda

Shinya Morita

A substrate processing apparatus in accordance with the present invention includes a process chamber configured to accommodate a substrate, a gas supply line configured to supply a gas to an inside of the process chamber, and an exhaust line configured to exhaust the inside of the process chamber. The gas supply line of the substrate processing apparatus includes a preheating unit preheating the gas supplied from a gas source, a metal pipeline having an angled section wherein the metal pipe line connects the preheating unit and the inside of the process chamber to supply the gas preheated by the preheating unit into the process chamber, and a heat dissipation member covering the angled section to dissipate heat from the angled section.

Substrate processing apparatus

A substrate processing apparatus comprises: an outer tube; a manifold connected to the outer tube and made of a non-metal material; an inner tube disposed in the manifold at a more inner side than the outer tube and configured to process a substrate therein; a heating device installed at a more outer side than the outer tube and configured to heat the inside of the outer tube; a lid configured to open and close an opening of the manifold, with a seal member intervened therebetween; and a heat absorption member installed in the manifold, with a bottom end of the inner tube intervened therebetween, and configured to absorb heat from the heating device, the heat absorption member being made of a non-metal material.

Growing community of inventors

Toyama, Japan

Koichi Sada