Ebara Corporation

Koichi Fukaya

Tetsuji Togawa

Osamu Nabeya

Hiroshi Yoshida

Makoto Fukushima

Fumitoshi Oikawa

Mitsuru Miyazaki

Tomoatsu Ishibashi

Shinji Kajita

Tomoaki Fujimoto

Akira Nakamura

Taro Takahashi

Takahiro Ogawa

Takuya Inoue

Mitsuo Tada

Hisajiro Nakano

Yasunari Suto

Kenichi Sugita

Hozumi Yasuda

Hiroki Takahashi

Takayuki Saito

Kohei Sato

Itsuki Kobata

Yasuyuki Motoshima

Nobuyuki Takada

Mitsuhiko Shirakashi

Yasushi Toma

Tsukuru Suzuki

Masayuki Kumekawa

Kaoru Yamada

Takeshi Iizumi

Yuji Makita

Yohei Eto

A substrate cleaning apparatus includes a substrate rotation supporting section that supports and rotates a substrate; a roll holding section that rotatably holds a first roll cleaning member and a second roll cleaning member each having a length almost equal to a radius of the substrate; a roll rotation drive section that rotates the first roll cleaning member and the second roll cleaning member about respective axes of rotation parallel to a front surface of the substrate; and a roll pressing section that brings the first roll cleaning member and the second roll cleaning member that are rotating into sliding contact with the front surface of the substrate. The first roll cleaning member and the second roll cleaning member are disposed so as to cover different radial parts of the front surface of the substrate.

Substrate cleaning apparatus and substrate cleaning method

The present invention relates to a substrate cleaning system and a substrate cleaning method for cleaning a substrate. The substrate cleaning system () includes a heater (), a chemical-liquid diluting module (), and a cleaning module. A temperature of the diluted-chemical-liquid mixed by the chemical-liquid diluting module () is determined to be higher than normal a temperature and lower than a glass transition point of a cleaning member. The cleaning member scrubs the substrate (W) with the diluted chemical liquid having the determined temperature supplied to the substrate (W).

Substrate cleaning system and substrate cleaning method

A cleaning apparatus includes: a cleaning tank that defines a cleaning space for cleaning a wafer; a wafer rotation mechanism that is arranged inside the cleaning tank and holds and rotates the wafer; a cleaning member that contacts and cleans a surface of the wafer, is rotatable around a central axis extending in a lateral direction, and has a length in an axial direction longer than a radius of the wafer; a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank to move the cleaning member from a retracted position outside of the wafer to a cleaning position directly above the wafer; a second cleaning means that cleans the surface of the wafer; and a second swing mechanism that swings the second cleaning means around a second swing axis located inside the cleaning tank to pass directly above a center of the wafer.

Cleaning apparatus and polishing apparatus

A substrate cleaning apparatus has: a substrate rotating part that rotates a substrate; an edge cleaning member for cleaning an edge part of the substrate; an edge rotating part that rotates the edge cleaning member around an edge rotary shaft that extends in a direction orthogonal to a substrate rotary shaft; a moving part that moves a position of the edge cleaning member with respect to the edge part of the substrate; and a control part that controls the moving part to move the position of the edge cleaning member with respect to the edge part of the substrate, and causes the edge cleaning member to clean a one-side edge area including a face on one side, a side face area including a side face, and an another-side edge area including a face on another side in the edge part of the substrate.

Substrate cleaning apparatus and cleaning method of substrate

An apparatus for cleaning a substrate has a holding unitthat holds a substrate W; a rotated unitconnected to the holding unit; a rotating unitthat is provided on a peripheral outer side of the rotated unitand rotates the rotated unit; and a cleaning unitthat physically cleans the substrate W held by the holding unit

Apparatus for cleaning substrate and substrate cleaning method

A substrate washing device includes a substrate holding mechanismthat holds a substrate W, a substrate rotating mechanismthat rotates the substrate W held by the substrate holding mechanism, and a two-fluid nozzlethat ejects a two-fluid jet toward a surface of the rotating substrate W. The two-fluid nozzleis formed of a conductive material. Accordingly, the electrification amount of droplets ejected as the two-fluid jet from the two-fluid nozzlecan be suppressed.

Substrate washing device

A substrate drying apparatus includes a drying gas nozzle configured so that, assuming that a surface WA of the substrate W is a projection plane, regarding the drying gas flow Gf in the nozzle moving direction Dr, a collision position Gfw with the substrate W is located downstream of a projected discharge position Gfv', the projected discharge position Gfv&#x2032; being a discharge position from the drying gas nozzle projected on the projection plane. In a three-dimensional space, the drying gas flow Gf is inclined, such that an angle &#x3b1; formed by an axis Ga of the drying gas flow Gf and a vertical line Wp of the substrate W is in a range from a half contact angle &#x3b8;/2 to an angle determined by deducting the half contact angle &#x3b8;/2 from 90&#xb0;, the half contact angle &#x3b8;/2 being a half of the contact angle &#x3b8;.

Substrate drying apparatus, substrate drying method and control program

A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.

Substrate holding apparatus and polishing apparatus

The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table () having a polishing surface (), a substrate holder () for holding and pressing a substrate (W) against the polishing surface () of the polishing table (), and a film thickness measuring device () for measuring a thickness of a film on the substrate (W). The substrate holder () has a plurality of pressure adjustable chambers (to), and pressures in the respective chambers (to) are adjusted based on the film thickness measured by the film thickness measuring device ().

Substrate polishing apparatus and substrate polishing method

An electrolytic processing apparatus which, while eliminating a CMP processing entirely or reducing a load on a CMP processing to the least possible extent, can process and flatten a conductive material formed in the surface of a substrate, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The present invention includes an electrode section including a plurality of electrode members disposed in parallel, each electrode member including an electrode and an ion exchanger covering the surface of the electrode, a holder for holding a workpiece, which is capable of bringing the workpiece close to or into contact with the ion exchanger of the electrode member, and a power source to be connected to the electrode of each electrode member of the electrode section. The ion exchanger of the electrode member includes an ion exchanger having an excellent surface smoothness and an ion exchanger having a large ion exchange capacity.

Electrolytic processing apparatus and electrolytic processing method

A substrate holding device according to the present invention includes an elastic membrane to be brought into contact with a rear surface of a substrate, an attachment member for securing at least a portion of the elastic membrane, and a retainer ring for holding a peripheral portion of the substrate while in contact with the elastic membrane. The elastic membrane comprises at least one projecting portion, and the attachment member comprises at least one engagement portion engaging side surfaces of the at least one projecting portion of the elastic membrane. The elastic membrane further comprises bellows portions expandable in a pressing direction so as to allow the elastic membrane to press the substrate, and contractible along the pressing direction.

Substrate holding device and polishing apparatus

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Tokyo, Japan

Koichi Fukaya