Nikon Corporation

Nippon Kogaku K.k.

Kiyoto Mashima

Takashi Mori

Osamu Tanitsu

Akikazu Tanimoto

Hiroshi Shirasu

Katsuhiko Murakami

Keiichiro Sakato

Joji Iwamoto

A reflection reduction projection optical system having large numerical aperture for use in X-ray lithography. The reflection reduction projection optical system includes at least five aspheric surface reflecting mirrors and a reflecting mirror having a predetermined configuration, causing reduction imaging on an imaging surface I by imaging a light beam from an object O only one time. The reflection reduction projection optical system includes, in light path sequence from the object, a first convex mirror, a first concave mirror, the mirror having a predetermined configuration, a second concave mirror, a second convex mirror, and a third concave mirror. The reflection reduction projection optical system also includes an aperture stop located on the second convex mirror.

Reflection reduction projection optical system

An optical element for X-ray reflection according to the present invention is provided with a number of fine convex surfaces or concave surfaces regularly arranged on a substrate. Multilayer films reflecting X-rays are formed over the convex surfaces or concave surfaces. The convex surfaces or concave surfaces have such a shape that when X-rays enter each concave surface or convex surface, they are reflected with a certain diverging angle by the multilayer films and as a result that a plurality of secondary X-ray sources having the diverging angle are formed on a same plane located a certain distance apart from the concave surfaces or convex surfaces. By this, a number of secondary X-ray sources are formed to enable uniform irradiation of X-rays in a wide region.

Optical element, production method of optical element, optical system,

A laser processing apparatus for projecting a spot of laser beam onto a portion of a microcircuit pattern on a semiconductor wafer, photographic mask or the like to cut the lead or anneal the limited area. The laser processing apparatus includes a mark detector for detecting the positions of first marks preliminarily provided on a work as the relative positions to the detection centers of the mark detector itself, a controller for controlling a processing energy beam generator so as to form on the work second marks detectable by the mark detector, and an error detector responsive to the results of the position detection of the second marks by the mark detector so as to detect relative positional errors between the focussing centers of the energy beam on the work and the detection centers of the mark detector.

Laser processing apparatus

A multi-wavelength optical apparatus for laser processing, alignment and observation employs dichroic mirrors, which, by virtue of their wavelength characteristics, affect a processing laser beam differently from alignment and observation light. A projection optical system and a dichroic mirror form first and second images of an aperture on an object disposed on a movable stage from processing light and alignment light, respectively. The position of the second image relative to a reference is determined and automatically provides the position of the first image relative to the reference. The apparatus is used to repair microdefects in semiconductor circuit elements, for example.

Growing community of inventors

Kawasaki, Japan

Kiyoto Mashima