Omron Corporation

Kiyoshi Murakami

Shinji Sugita

Teruhisa Yotsuya

Yoshiki Fujii

Masayuki Masuda

Masato Ishiba

Jun Kuriyama

Takashi Kinoshita

Hironori Kasahara

Hideyuki Hayashi

Kunio Yoshida

Yasunori Asano

This invention enables information on a connection wiring with a substrate of a mounted component to be accurately and easily inputted in an X-ray examination apparatus. In teaching of a substrate examination, when a user inputs a two-dimensional region of a component to be examined with respect to a visible light image of the substrate, three-dimensional data is generated for the relevant region, which data is then analyzed to acquire a center coordinate, the number, the number of rows, and the number of columns on a ball terminal connecting the component to the substrate. Results such as the center coordinate acquired in such a manner may be displayed. The visible light image for the substrate is displayed in a display field of a screen. In the display field, a frame corresponding to a region acquired as an examination target is displayed in accordance with the visible light image, and a frame corresponding to each solder ball is displayed based on a position and the like of the solder ball acquired based on the three-dimensional data.

X-ray examination region setting method, X-ray examination apparatus and X-ray examination region setting program

Inspection apparatus are used to inspect a substrate as solder is printed, components are mounted and the substrate is heated for a soldering process. Images of the substrate are taken both before and after a production process such as the component mounting process and the soldering process and their differences are extracted. Each component on the substrate may be identified by differentiation and binarization processes and setting conditions for windows are determined corresponding to identified components. Windows are set according to determined setting conditions for inspecting the conditions of the substrate by using image data in the set windows and standard inspection data corresponding to component identification data.

Methods of and apparatus for inspecting substrate

Where substrates with components are produced through a series of production processes and inspected after each of these production processes, a method is provided for setting an optimum reference value for making judgments in these inspections such that the frequency of occurrence of disagreement between inspection results after an intermediate process and after the final results will come to within a specified range. After an initial value is assigned for a reference value, this value is sequentially varied while repeating specified processes of saving measured and judgment data on inspected portions of components in a memory and setting a reference value by using the data saved in the memory until a specified condition becomes satisfied.

Method, device and program for setting a reference value for substrate inspection

A color image as a combination of color data corresponding to a plural n-number of different hues is processed by extracting a target object from the image and carrying out a specified image processing. A reference image is obtained in the absence of the target object. Color data corresponding to specified less than n of the different hues are considered and difference in the degree of intensity of the considered color data relative to the combination of color data corresponding to n different hues between each pixel of the target image containing the target object and a corresponding pixel on the reference image are extracted. Pixels for which the extracted difference is greater than a specified threshold value and is in a specified direction are extracted. An image area formed by the extracted pixels are recognized as the target object.

Image processing method, substrate inspection method, substrate inspection apparatus and method of generating substrate inspection data

Preparation steps are taken before a substrate with components is inspected and a whole image of a standard substrate is prepared preliminarily and inspection areas are determined for target portions to be inspected on this whole image. At the time of the inspection, a camera is positioned corresponding to a target portion to obtain a target image and an area corresponding to the target image is extracted from the whole image and displacement values of this area are calculated relative to the target image. The setting position of the inspection area is corrected by the calculated displacement values and an inspection area is set on the target image based on the corrected coordinates.

Substrate inspection method and apparatus

A target object has its surface condition inspected by having its image taken from above while being irradiated by red, green and blue light beams at different elevation angles. An inspection area is set on the image and a direction is extracted on the image in which a change appears in the color phase according to the arrangement of the light sources and this extracted direction is compared with a preliminarily registered standard direction to judge the surface condition from the result of this comparison.

Apparatus for surface inspection and method and apparatus for inspecting substrate

For generating an image for inspection of a substrate, a camera is provided above this substrate with an optical axis orienting downward and a plurality of multi-colored light emitting members are set around the optical axis of the camera so as to be within a specified angular range with respect to a target area on the substrate. The camera is operated to generate an image of the target area for inspection while switched-on conditions of these light emitting members are being controlled such that the colors and angles of light illuminating this target area are varied according to a specified kind of the purpose of this inspection.

Method of generating image and illumination device for inspecting substrate

On a production line for component mounting substrate, mutually communicating inspection apparatus are each provided to a different one of production processes that are carried out sequentially such as the solder printing, component mounting and soldering processes. Each inspection apparatus can generate an X-ray transmission image of the substrate. Each inspection apparatus on the downstream side inputs an image from another inspection apparatus on the upstream side and generates a differential image of the inputted image and an X-ray transmission image of the same substrate generated by itself after the production process associated with itself is carried out. The differential image thus generated is used for inspecting the substrate such that the effect of the associated production process can be more accurately inspected.

Inspection method and system for and method of producing component mounting substrate

Inspection a is executed between a step B of mounting a chip component by a high-speed mounter and a step C of mounting a odd-shaped component by a odd-shape mounter. The inspection a executes not only mounted component inspection for determining a mounted state of a chip component mounted in the preceding step but also component fly inspection for determining whether a chip component is flown to a position where a odd-shaped component is mounted in the next step C. It is possible to execute the component fly inspection in accordance with a condition corresponding to the situation of an actual spot such as a case in which it is detected that a component is missing in mounted component inspection or a case in which the replacement date of an attracting nozzle in a high-speed mounter is approaching.

Substrate inspecting method and substrate inspecting apparatus using the method

In a substrate inspecting apparatus comprising a projecting section () in which light sources (), () and () are provided for emitting colored lights of R, G and B in directions having different elevation angles, one or two color components which is/are greater than the mean value of the intensities of color components is/are extracted for an inspecting region including a soldered portion. Inclined surfaces adapted to the light sources (), () and () are converted into monochromatic shaded images by the extraction processing. A boundary position between the inclined surfaces adapted to the light sources () and () are converted into one shaded image having a mixed color of red and green and the boundary position between the inclined surfaces adapted to the light sources () and () is converted into a different shaded image.

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Kyoto, Japan

Kiyoshi Murakami