Tokyo Electron Limited

Tokyo Electron Kyushu Limited

Tokyo Electron Kyuchu Limited

Kimio Motoda

Kiyohisa Tateyama

Noriyuki Anai

Mitsuhiro Sakai

Kiyomitsu Yamaguchi

Tetsu Kawasaki

Yoshitaka Matsuda

Kenji Sekiguchi

Tsutae Omori

Takenobu Matsuo

Kazuki Denpoh

Tatsuya Iwasaki

Norio Wada

Yoichi Honda

Fumio Satou

Takeshi Tsukamoto

Norifumi Kohama

Eiji Yamaguchi

Takashi Terada

Toshifumi Inamasu

Yosuke Omori

Takayuki Ishii

Tetsuya Sada

Kenji Sugakawa

Shigeto Tsuruta

Yoshiharu Ota

Norio Uchihira

Tsuyoshi Yamasaki

Atsushi Yamashita

Kenya Shinozaki

A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.

Substrate processing apparatus and substrate processing method

A local deformation which is generated on bonded substrates can be reduced. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit configured to attract and hold a second substrate from below; a striker configured to bring the first substrate into contact with the second substrate by pressing a central portion of the first substrate from above; a moving unit configured to move the second holding unit between a non-facing position where the second holding unit does not face the first holding unit and a facing position where the second holding unit faces the first holding unit; and a temperature control unit disposed to face the second holding unit placed at the non-facing position and configured to locally adjust a temperature of the second substrate attracted to and held by the second holding unit.

Bonding apparatus and bonding method

A coating apparatus includes a nozzle, a moving mechanism, a pressure adjusting unit and a pressure control unit. The nozzle is provided with a storage chamber and a slit-like flow path, and configured to discharge the coating liquid from a discharge port formed at a front end of the flow path. The moving mechanism moves the nozzle and a substrate relatively to each other along the surface of the substrate. The pressure adjusting unit adjusts the pressure inside the storage chamber. The pressure control unit controls the pressure adjusting unit so as to adjust pressure inside the storage chamber. The pressure control unit controls the pressure adjusting unit such that the inside of the storage chamber becomes a negative pressure, and fills the coating liquid inside the storage chamber while slowly decreasing the negative pressure inside the storage chamber.

Coating apparatus and method for filling coating liquid

The present invention provides a floating-type substrate conveying and processing apparatus that floats a substrate to be processed. The device includes a floating stage that floats the substrate, a liquid supplier placed above the floating stage via the substrate to supply a process liquid to a surface of the substrate, and a moving mechanism for holding the substrate as detachable at opposite ends of the substrate, at a floating height of the substrate, and for moving the substrate on the floating stage. The floating stage is formed of a porous member and has a plurality of suction apertures airtightly defined in a porous portion of the porous member. The floating stage injects gas through the porous portion and sucks gas through the suction apertures to float the substrate placed on the porous portion.

Floating-type substrate conveying and processing apparatus

A coating apparatus has a spin chuck for attracting and holding a semiconductor wafer in a horizontal state by means of vacuum. A movable beam is arranged above the spin chuck. The movable beam includes first and second nozzles integrally formed. The first nozzle is used for supplying a photo-resist liquid while the second nozzle is used for supplying a solvent for the photo-resist liquid. When a coating process is performed, the movable beam above the wafer is horizontally moved in one direction. The solvent is first supplied onto the wafer from the second nozzle, and the coating or photo-resist liquid is then supplied from the first nozzle, following the solvent. Wettability of the wafer relative to the photo-resist is increased by the solvent, prior to supply of the photo-resist liquid.

Coating method and apparatus for semiconductor process

A nozzle provided with a plurality of discharge apertures in line for discharging a resist solution as a coating solution toward a top surface of a substrate G held by a holding plate is provided at a lower portion of a main body of a coating head. The resist solution is simultaneously discharged from the plurality of discharge apertures while the nozzle is scan-moved in a direction orthogonal to an arranging direction of the discharge apertures. With the above configuration, the disadvantage of the coating solution dropping or the like is eliminated, the waste of the coating solution is avoided, and in addition, the time taken to perform coating processing is reduced.

Coating apparatus

An apparatus for a treatment is provided, the apparatus comprising a vessel for recovering a treatment liquid flowing out or flying out when the object is treated, cleaning means for cleaning an inner wall surface of the vessel by supplying a cleaning liquid into the vessel, and a circulation system for recovering a discharged liquid discharged from the vessel when the inner wall surface of the vessel is cleaned by the cleaning means and supplying the recovered liquid to the cleaning means.

Method and apparatus for cleaning treatment

A substrate processing apparatus comprising a substrate mounting table, a cup having an upper opening and surrounding the substrate mounting table, a lid for opening/closing the upper opening of the cup, a support arm for supporting the lid, a first lifting mechanism having a first piston for supporting the support arm directly or indirectly and a first cylinder for guiding the first piston in an up-and-down motion, a second lifting mechanism having a second piston for supporting the support arm directly or indirectly and a second cylinder for guiding the second piston in up-and -down motion, a driving circuit for supplying the pressurized fluid to the first and second cylinders, independently and exhausting the pressurized fluid from the first and second cylinders, independently, and a control mechanism for controlling operations of the driving circuit.

Substrate processing apparatus

A scrubbing apparatus comprises a holding member, which holds the outer circumference of the substrate from its back surface and has an opening to expose the back surface of the held substrate toward the bottom side; a supporting member, which supports substantially the center between two opposed sides of the holding member; a scrubbing brush, which comes in contact with the exposed back surface of the substrate from the bottom side; a brush drive mechanism, which transfers the scrubbing brush along the two opposed sides of the holding member; and a rotation drive mechanism, which drives to rotate the holding member together with the supporting member. Thus, a space can be saved, and the back surface of the substrate can be scrubbed.

Scrubbing apparatus and scrubbing method

A coating apparatus comprises a rotary container rotatable about a rotational axis as the center, a rotary rest table, located in the rotary container to be movable vertically and rotatable about the rotational axis as the center, for supporting a target substrate thereon, coating solution supply pipe for applying a coating solution to the target substrate, cleaning solution supply pipe for spraying a cleaning solution to an inner surface of the rotary container, a seal member provided between the rotary rest table and the bottom wall of the rotary container and capable of sealing a gap between the rotary rest table and the bottom wall of the rotary container, and connecting mechanism for connecting the rotary container and the rotary rest table so as to rotate together. The cleaning solution supply pipe projects from a through hole formed in the upper portion of the rotary container to be coaxial with the rotational axis, and the coating solution supply pipe projects from the through hole of the rotary container to be coaxial with the rotational axis.

Coating apparatus and method therefor

Disclosed is an apparatus for forming a coating film for semiconductor processing, including a holder for holding a substrate, a coating solution supply device arranged to face one main surface of the substrate held by the holder and provided with a discharge port for supplying a coating solution onto the one main surface of the substrate, the coating solution forming a band-like stream having a width smaller than that of the substrate, a moving device for moving the coating solution supply device in parallel and relative to the substrate held by the holder to form a coating region and a non-coating region on the one main surface of the substrate, and a clearance retaining device for maintaining constant the distance between the discharge port of the coating solution supply device and the one main surface of the substrate.

Apparatus for forming coating film for semiconductor processing

The invention provides an apparatus for treating a substrate with resist, comprising a spin chuck for horizontally holding a substrate, a first motor for variably rotating the spin chuck, a nozzle for applying resist solution onto the upper surface of the substrate held on the spin chuck, a cup having an upper opening through which the substrate is put in or taken out of the cup and a lower opening through which extends the driving shaft of the spin chuck, the cup positioned to surround the substrate held on the spin chuck to receive liquid centrifugally separated from the substrate which is rotated about its axis, a lid to close the upper opening of the cup to define a space around the substrate, a second motor for variably rotating the cup independently of the spin chuck rotation, a liftable cylinder for relatively moving at least one of the spin chuck and cup, which are positioned apart from each other, toward each other to achieve mutual contact, and an O-ring for hermetically sealing the mutual contact portion between the cup and spin chuck when these cup and spin chuck are brought into mutual contact by the liftable cylinder. When the cup and spin chuck are brought into mutual contact by the liftable cylinder, the lower opening of the cup is closed by the spin chuck to form a hermetic space. The spin chuck and cup are rotated in synchronism by first and second motors while the chamber is kept hermetically closed.

Apparatus for treating a substrate with resist and resist-treating method

A method for processing substrates, comprising the steps of (a) disposing a substrate on a supporting table, followed by preparing a nozzle and a contact adjusting member in a waiting position apart from the substrate disposed on the supporting table and further preparing removing means in a position intermediate between the waiting position and an operating position, (b) allowing a solvent to be attached to the contact adjusting member in the waiting position and moving the contact adjusting member relative to the nozzle so as to bring the process solution present in the solution discharge port of the nozzle into contact with the solvent attached to the contact adjusting member and, thus, to adjust the condition of the process solution present in the solution discharge port of the nozzle, (c) moving the nozzle from the waiting position to an operating position through the removing means so as to allow the process solution spurted from the nozzle to be moved into the removing means, and (d) moving the substrate and the nozzle relative to each other while allowing the process solution to be spurted from the nozzle so as to form a film of the process solution on the substrate.

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Kumamoto, Japan

Kimio Motoda