Fujitsu Corporation

Adv Antest Corporation

Kiichi Sakamoto

Yasushi Takahashi

Hiroshi Yasuda

Akio Yamada

Yoshihisa Oae

Satoru Yamazaki

Tomohiko Abe

Takamasa Satoh

Junichi Kai

Hidefumi Yabara

Isamu Seto

Masami Takigawa

Kenichi Kawakami

Soichiro Arai

Shunsuke Fueki

Takayuki Sakakibara

Kenichi Miyazawa

Katsuhiko Kobayashi

Hisayasu Nishino

Takashi Kiuchi

Jinko Kudou

Satoru Sagoh

Hitoshi Watanabe

Yoshihisa Ooaeh

Hideki Nasuno

Tatsuro Ohkawa

Manabu Ohno

Tomohiro Sakazaki

Akio Takemoto

Satoru Sagou

Kenichi Kawashima

Junko Hatta

Toyotaka Kataoka

Atsushi Saito

Nobuyuki Yasutake

Moritaka Nakamura

Masaaki Miyajima

Kazutaka Taki

Shinji Miyaki

Yoshio Suzaki

A method of exposing a wafer to a charged-particle beam by directing to the wafer the charged-particle beam deflected by a deflector includes the steps of arranging a plurality of first marks at different heights, focusing the charged-particle beam on each of the first marks by using a focus coil provided above the deflector, obtaining a focus distance for each of the first marks, obtaining deflection-efficiency-correction coefficients for each of the first marks, and using linear functions of the focus distance for approximating the deflection-efficiency-correction coefficients to obtain the deflection-efficiency-correction coefficients for an arbitrary value of the focus distance. A device for carrying out the method is also set forth.

Charged-particle-beam exposure device and charged-particle-beam exposure method

A method of detecting deficiency of an aperture used in a charged-particle-beam exposure process employing at least two exposure columns is disclosed, where each of the two exposure columns passes a charged-particle beam through the aperture formed through a mask to shape a cross section of the charged-particle beam before exposing the charged-particle beam onto an object. The method includes the steps of mounting masks having the same aperture to the at least two exposure columns; scanning, in each of the at least two exposure columns, the charged-particle beam over an area containing a mark on a surface substantially at the same height as the object after passing the charged-particle beam through the same aperture; obtaining, in each of the at least two exposure columns, a signal waveform corresponding to the scan by detecting charged particles scattered by the mark; and comparing the signal waveform between the at least two exposure columns.

Charged particle-beam exposure device and charged-particle-beam exposure

In an exposure mask of the present invention, a plurality of opening regions are disposed via crossbeams, each having a size not to be resolved, along peripheral edges of island-like patterns and peninsula-like patterns for shielding transmission of charged particles.

Electron beam exposure mask and method of manufacturing the same and

Disclosed is a method of producing a block mask, which is employed in an electron-beam lithography apparatus, with high precision irrespective of the size of openings. The electron-beam lithography apparatus is of a type that produces a unit pattern at a time by transmitting an electron beam through openings selected from among a plurality of kinds of openings of a block mask, links the unit pattern with a previous one, and repeats this process to delineate a desired pattern. The method consists of four steps. At the first step, a resist is applied to the surface of a substrate of a block mask. At the next step, the resist is exposed to delineate patterns of a plurality of kinds of openings. At the next step, the exposed resist is developed. At the next step, the substrate of the block mask is etched. Herein, at the step of exposing the resist to delineate the patterns of a plurality of kinds of openings, for exposing the resist to delineate a pattern of openings that are larger than a predetermined size, the perimeters of corresponding opening portions of the resist are exposed by a predetermined width. However, the insides of the corresponding opening portions remain unexposed. Once etching is completed, the perimeter of each large opening portion becomes a penetrating hole. The inside thereof is detached from the substrate of the block mask. A larger hole is thus realized. Consequently, even when the etching is carried out under the same conditions for etching performed to create small openings, large openings can be created with high precision.

Method of producing block mask for electron-beam lithography apparatuses

Charged-particle-beam exposure device and charged-particle-beam exposure

A method for providing charged particle beam exposure onto an object having a plurality of chip areas with a plurality of aligning marks formed in correspondence to each of said chip areas. A charged particle beam is irradiated upon an object mounted on a mobile step based upon positions of the aligning marks. Actual positions of the alignment marks are detected and compared to the design positions of the alignment marks to determine approximate relationships which are used to calculate an actual position to perform exposure.

Method of providing changed particle beam exposure in which

A device exposing an object to an electron beam employs a mask formed of a plate of material which blocks the electron beam and which has plural pattern exposure blocks defined therein, each having one or more aperture defining regions therein and, when selected, determining the shaping of the electron beam passing therethrough so as to expose a respective pattern on an object. Each aperture-defining region has a respective single aperture or respective plural, spaced apertures formed therein and having a total area size selected to be smaller than the area size of the aperture defining region, in accordance with controlling the current level of an electron beam passing therethrough, while reducing Coulomb interaction of the electron beam passing through the aperture or apertures of each aperture defining portion of the pattern exposure block.

Mask and method of creating mask as well as electron-beam exposure

Method of detecting a deficiency in a charged-particle-beam exposure mask

A mask for exposure of an object by an electron beam is formed of a plate of material which blocks the electron beam and which has plural pattern exposure blocks defined therein, each having one or more aperture defining regions therein and, when selected, determining the shaping of the electron beam passing therethrough so as to expose a respective pattern on an object. Each aperture-defining region has one aperture or plural, spaced apertures formed respectively therein, having a total area size, selected to be smaller than the area size of the aperture defining region in accordance with controlling the current level of an electron beam passing therethrough, while reducing Coulomb interaction of the electron beam passing through the aperture or apertures of each aperture defining portion of the pattern exposure block.

To improve in the throughput of an exposure system, the setting time during a step change in the output of an amplifier is reduced by switching resistance between the amplifier and deflector, a glitch waveform generated during a step change in the output of a D/A converter at the preceding stage of the amplifier, is anticipated and is canceled out with a correction waveform, after the output of the D/A converter has settled, this output is sample held and the step change is interpolated at a smoothing circuit, the deflection area is increased by positioning a electrostatic deflector offset around the optical axis relative to another electrostatic deflector, the response speed of the main deflection is improved by adding auxiliary deflection coils of one or two turn, and the alignment time is reduced by combining the coordinate conversion in the wafer area and in the chip area. In order to correct the astigmatism of the electromagnetic lens, two stages of coils are provided and an electric current corresponding to the quantity of deflection is supplied to the coils.

Method of and system for charged particle beam exposure

To improve the throughput of an exposure system, the setting time during a step change in the output of an amplifier is reduced by switching resistance between the amplifier and a deflector. A glitch waveform generated during a step change in the output of a D/A converter at the preceding stage of the amplifier is anticipated and is cancelled out with a correction waveform. After the output of the D/A converter has settled, this output is sample-held and the step change is interpolated with a smoothing circuit. The deflection area is increased by positioning an electrostatic deflector offset around the optical axis relative to another electrostatic deflector, and the response speed of the main deflection is improved by adding auxiliary deflection coils of one or two turns. The alignment time is reduced by combining the coordinate conversion in the wafer area and in the chip area. In order to correct the astigmatism of the electromagnetic lens, two stages of coils are provided and an electric current corresponding to the quantity of deflection is supplied to the coils.

In a block exposure pattern extracting system applied to a charged-particle beam exposure system having a block mask including a plurality of transparent stats having different shapes, a comparator unit compares first vectors connecting one of apexes of an input exposure pattern to other apexes thereof with second vectors connecting a reference point which is one of apexes of a unit block exposure pattern to other apexes of the unit block exposure pattern. A determining unit determines whether or not the first vectors coincide with the second vectors. An extracting unit extracts the input exposure pattern as the unit block exposure pattern when the determining unit determines that the first vectors coincide with the second vectors.

Block exposure pattern data extracting system and method for charged

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Kawasaki, Japan

Kiichi Sakamoto