Rohm & Haas Electronic Materials LLC

Dow Global Technolgoies LLC

Rohm and Haas Company

Kevin Y Wang

Michael K Gallagher

Robert K Barr

Duane R Romer

Kim Sang Ho

Gregory P Prokopowicz

Corey O'Connor

Elissei Iagodkine

Matthew Martin Yonkey

Zidong Wang

Raymond J Thibault

Xiang Qian Liu

Gregory D Prokopowicz

Colin Hayes

Colin Calabrese

The present disclosure relates to a photosensitive composition comprising a photoinitiator and a bismaleimide component, photopolymers comprising the photosensitive composition and their use, especially in electronic devices. The bismaleimide component includes a bismaleimide compound or a bismaleimide oligomer.

Photosensitive bismaleimide composition

Arylclobutene-containing multi-functional monomers are useful in the preparation of arylcyclobutene-based polymer coatings. Compositions comprising one or more arylclobutene-containing multi-functional monomers and one or more oligomers comprising as polymerized units one or more arylcyclobutene monomer provide arylcyclobutene-based polymer coatings having reduced stress. Such compositions are useful in the manufacture of electronic devices.

Arylcyclobutenes

Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate.

Adhesion promoter

Growing community of inventors

Marlborough, MA, United States of America

Kevin Y Wang