Micron Technology Incorporated

Kevin M Dowdle

Jaspreet Singh Gandhi

Brandon P Wirz

Irina V Vasilyeva

Christopher J Gambee

Yang Chao

Keith E Ypma

Jon Hacker

Various embodiments of microelectronic devices and methods of manufacturing are described herein. In one embodiment, a method for aligning an electronic feature to a through-substrate via includes forming a self-aligned alignment feature having a wall around at least a portion of the TSV and aligning a photolithography tool to the self-aligned alignment feature. In some embodiments, the self-aligned alignment feature is defined by the topography of a seed material at a backside of the device.

Semiconductor devices and methods for backside photo alignment

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Pocatello, ID, United States of America

Kevin M Dowdle