Dow Global Technolgoies LLC

Rohm and Haas Company

Dow Silicones Corporation

Kevin J Bouck

James P Godschalx

Edward Otto Shaffer, Ii

Paul H Townsend, Iii

Kenneth J Bruza

Dennis W Smith, Jr

Qing Shan J Niu

David H Bank

Daniel Lawrence Dermody

Manesh Nadupparambil Sekharan

Craig F Gorin

David L Malotky

Scott T Matteucci

William Gerald Stobby

Richard Allen Lundgard

Shrikant Dhodapkar

Dean M Millar

Jun Jason Cai

Thomas J Parsons

Jason A Reese

Beata A Kilos

Abhijit A Namjoshi

Remi A Trottier

Amit K Chaudhary

Rebekah K Feist

Cathy L Tway

Marsha L Langhorst

Richard Baumer

Nicholas B Schaffer

Daniel T Youmans

Weijun Wang

Sarah E Decato

Intan M Hamdan

Mark D Fisher

Jacob Milne

Thomas Tomczak

Jun Cai

A coating composition which comprises a dispersion which is a melt blended product of one or more olefinic base polymers; one or more dispersants; one or more compatibilizers; water; and optionally base; wherein the dispersion exhibits an average volume mean particle size diameter of less than or equal to 2 microns, a solids content of equal to or less than 70 wt %, and a pH of 8 or greater; one or more rheology modifiers; and optionally one or more neutralizing agents is provided. An article coated with the coating composition and a method of making the coated article are also provided.

Coating composition, a coated fabric, a method of making a coated fabric, and an article made from the coated fabric

A composition comprising the following components: A) a metal stearate; B) a secondary alcohol ethoxylate of the formula CHO [CHCHO]H, wherein x=7; C) a secondary alcohol ethoxylate of the formula CHO [CHCHO]H, C wherein x=20; D) octanoic acid; E) sodium lauryl sulfate; F) a polydimethylsiloxane (PDMS); and G) water.

Shelf stable aqueous dispersions suitable for use in food contact applications

A method of preparing a resin infused random fiber mat including the step of forming a liquid dispersion mat of polymeric resin and fiber on a porous substrate.

Manufacture of composite dispersion based resin-infused random fiber mat

The present invention provides thermosetting resin pre-impregnated or infused fiber materials or prepregs comprising a thermosetting resin mixture and a fiber material component of a heat resistant fiber, such as carbon fiber, having an areal weight of from 500 to 3,000 g/m2 having a coating of from 0.5 to 4 phr of a latent, particulate curative or solid curative, preferably, dicyandiamide, wherein the prepregs are infused with a thermosetting resin mixture comprising (a) at least one liquid epoxy resin, and (b) a hardener and/or a catalyst, as well as methods of making the same. The prepregs of present invention enables the simple provision of lightweight composites having consistent resin cure throughout.

Catalyst-doped sizing agent for preparation of high areal weight fiber shelf-stable prepreg or molding compound intermediates

Disclosed herein are polyisocyanurate and/or polyurethane foams containing non-porous silica particles derived from mesoporous cellular foams, wherein the polyisocyanurate and/or polyurethane foams have enhanced heat and/or fire resistance. Processes for making such foams and methods of using them are also disclosed.

Polyisocyanurate foams containing dispersed non-porous silica particles

A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tof greater than 300&#xb0; C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.

Composition containing a cross-linkable matrix precursor and a poragen, and porous matrix prepared therefrom

Composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom

A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a T of greater than 300&deg; C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.

Growing community of inventors

Midland, MI, United States of America

Kevin J Bouck