Nikon Corporation

Kesayoshi Amano

Ken Hattori

Yukio Kakizaki

Masao Nakajima

Toshikazu Umatate

Toru Kiuchi

Masayoshi Naito

Naomasa Shiraishi

Atsushi Yamaguchi

Hideo Mizutani

Yuji Imai

Shinji Wakamoto

Hideaki Sakamoto

Masaaki Aoyama

In order to reduce mask pattern transfer error caused by expansion of the mask substrate during transferring the circuit pattern onto the photosensitive substrate, a mask substrate is loosely supported on a plurality of mounts on the mask stage so that the mask substrate can freely expand in response to changes in its temperature. A measuring instrument (such as a temperature sensor or an interferometer) is used to measure a value representing the expansion amount of the mask substrate. Alignment and positioning of the mask substrate and the photosensitive substrate is adjusted in response to the expansion amount of the reticle, based on the measured value.

Mask substrate, projection exposure apparatus equipped with the mask

An inclination detecting apparatus is for detecting an inclination of a front surface of a transparent wafer placed on a perpendicular to an optical axis of a projection objective in an exposure apparatus. The inclination detecting apparatus includes an illumination optical system and a condenser optical system. The illumination optical system obliquely supplies a collimated beam onto the front surface of the wafer. The condenser optical system can condense the collimated beam supplied from the illumination optical system and reflected by the wafer, and it has a quartered photodetector for receiving the reflected beam and generating a position signal corresponding to a light receiving position. The apparatus further includes a first slit plate and a second slit plate located in the illumination optical system and the condenser optical system respectively. Each of the slit plate has a plurality of slits which are arranged such that light shield portions between slits of the second slit plate can cut off the collimated beam reflected by the back surface of the wafer.

Inclination detecting apparatus and method

Prior to a periphery exposing operation, a light emitting unit and a light receiving unit are retracted to a position separate from a wafer, and a calibrating operation is conducted in the retracted position utilizing a light shield plate different from the wafer to be exposed, thereby obtaining a servo control reference signal for the exposure. At the exposure of the periphery portion of the wafer, the exposure width is controlled according to the reference signal. It is therefore rendered possible to achieve exact peripheral exposure, including the intensity and intensity distribution of the exposing light beam immediately before the irradiation of the peripheral portion of the wafer.

Periphery exposing method and apparatus therefor

An exposing apparatus for exposing the periphery portion of a substrate on which resist is uniformly applied while rotating the substrate by a rotating device around a substantially central portion of the substrate, comprising: an irradiating device capable of irradiating a light beam, which is not sensed by the resist, toward the periphery portion of the resist; a light receiving device disposed to confront the irradiating device, receiving the light beam and outputting a light receipt signal in accordance with the quantity of received light; a detection device for detecting the rotational angle of the resist and outputting an angular signal; a moving device for relatively moving the light beam irradiated and the substrate in a radial direction; and a control device, wherein the substrate is disposed between the irradiating device and the light receiving device so as to shield a portion of the light beam and a control device controls the moving device in accordance with the light receipt signal and the angular signal so as to relatively move the light beam and the substrate in such a manner that the radial directional width of a region which is irradiated with the light beam is substantially constant in the periphery portion of the resist.

Apparatus for exposing peripheral portion of substrate

A device for positioning a circular substrate having a cut portion, comprising: a first rotational stage which is finely rotated around the origin of a rectangular coordinate system; an X-Y stage on the first rotational stage which is two-dimensionally moved in the coordinate system; a second rotational stage on the X-Y stage which is rotated while holding the substrate; a first detecting device for detecting information about the displacement change of the periphery of the substrate from the rotational center during the rotation of the second rotational stage; a first positioning controlling device for controlling the rotation of the second rotational stage in accordance with information detected by the first detecting device so that the cut portion is placed in a predetermined direction on the coordinate system; a second detecting device having three or more detecting points in the coordinate system so as to detect the three or more positions of the periphery, the second detecting device generating information about a detection at each of the three or more detecting points; and a second positioning controlling device for controlling the X-Y stage and the first rotational stage in accordance with the detection information from the second detecting device after the cut portion has been placed in the predetermined direction.

Device for positioning circular semiconductor wafers

An exposure apparatus for forming a pattern of a mask on a photo-sensitive substrate comprises an X-Y stage, a Z-stage supported on the X-Y stage, and a levelling stage that supports the photo-sensitive substrate. The levelling stage is supported on the Z-stage by a plurality of levelling devices that define a levelling reference plane, and that are operated in unison to change the level of the levelling stage relative to the Z-stage and relative to an exposure reference plane that is parallel to the levelling reference plane. The levelling devices are also operated individually to change the inclination of the photo-sensitive substrate relative to the levelling reference plane and relative to the exposure reference plane. A focus detector controls the movement of the Z-stage and the in-unison movement of the levelling devices. An inclination detector controls the individual operation of the levelling devices. The net result is that the surface of the photo-sensitive substrate is made coincident with the exposure reference plane and the levelling reference plane, and the center point of the surface of the photo-sensitive substrate becomes the pivotal center for changes in inclination of the photo-sensitive substrate.

Growing community of inventors

Tokyo, Japan

Kesayoshi Amano