Dainippon Screen Mfg. Co., Ltd.

Screen Holdings Co., Ltd.

Dainippon Screen Mgf. Co., Ltd.

Kentaro Tokuri

Hiroyuki Araki

Hiroaki Takahashi

Kenya Morinishi

Masaki Iwami

In a substrate processing apparatus, chemical-solution processing is performed by supplying a chemical solution to the upper surface of a substrate in a state where a top plate is located at a first relative position. Also, cleaning processing is performed by supplying a cleaning liquid to the upper surface of the substrate in a state where the top plate is located at a second relative position closer to the substrate than the first relative position is. Moreover, dry processing is performed on the substrate by rotating the substrate in a state where the top plate is located at a third relative position closer to the substrate than the second relative position is. This allows a chemical atmosphere above the substrate to be efficiently removed during the cleaning processing. Consequently, the occurrence of particles due to the chemical atmosphere above the substrate can be suppressed during the dry processing.

Substrate processing apparatus and substrate processing method

A substrate processing apparatus which holds and rotates a substrate substantially horizontally; having a control unit which controls a rinsing liquid supply mechanism for supplying a rinsing liquid onto the substrate; a gas knife mechanism that sprays gas onto the substrate to form a gas spraying zone and scans the entire substrate without rotating the substrate; a rinsing liquid mechanism for supplying a rinsing liquid onto the substrate at its area downstream from the gas spraying zone; and a drying unit for drying the substrate by rotating the substrate.

Substrate treating apparatus

A substrate processing method comprising: holding a substrate substantially horizontally by a rotatable substrate holding mechanism; supplying a rinsing liquid onto the top of the substrate held by the substrate holding mechanism at the substrate holding step; after the rinsing liquid supply step, spraying a gas onto the top of the substrate held by the substrate holding mechanism, by a gas knife mechanism, to form a gas spraying zone on the substrate top, and unidirectionally scanning the substrate top in its entirety by this gas spraying zone, without rotating the substrate; replenishing the rinsing liquid by supplying, in parallel to the gas knife spraying step, a rinsing liquid onto the substrate top at its area downstream in the gas-spraying-zone scanning direction rather than the gas spraying zone formed by the gas knife mechanism; and drying the substrate surface after the gas knife spraying step and the rinsing liquid replenishing step.

Substrate treating method

A substrate processing apparatus and a substrate processing method are capable of restraining or preventing the generation of streaky particles on a substrate surface by excellent removal of a rinsing liquid therefrom. The substrate processing apparatus has a substrate inclining mechanism for inclining a substrate held by a substrate holding mechanism. After a rinsing liquid has been supplied onto a substrate to form a liquid mass, the substrate is inclined at a small angle by the substrate inclining mechanism. Then, the liquid mass is downwardly moved without being fragmented and then falls down without leaving minute droplets on the substrate top. Thereafter, the substrate is returned to a horizontal posture and then dried.

Substrate treating apparatus and substrate treating method

An apparatus causes a substrate to rotate and supplies a treatment liquid to a substrate surface to make a treatment, without concern that a mixed substance is eluted from a cup in the use for a long time, or a thin film comes off from an inside wall surface to be contamination-causing substances even if the cup made of a water-repellent material for collecting a treatment liquid becomes hydrophilic. A cupdisposed to surround the sides and underside of a substrate W rotating while being held by a spin chuck, and serving to collect a treatment liquid diffused from the substrate to the surroundings, is made of a plastic material. Further, an inside wall surface of an upper-side cup partof the cup, being a portion on which the treatment liquid having been diffused from the substrate impinges, is roughened to be a hydrophilic surface.

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Kyoto, Japan

Kentaro Tokuri