Tokyo Electron Limited

Tokyo Electron Kyushu Limited

Tokyo Electron Saga Limited

Kenji Yokomizo

Yoshiyuki Honda

Masami Akimoto

Kazutoshi Yoshioka

Yuji Yoshimoto

Hirofumi Shiraishi

Yasuhiro Chouno

Kazuyoshi Mizumoto

Shinya Murakami

Eiichi Mukai

Osamu Tanaka

Chihaya Tashima

Naohiko Hamamura

Shouri Mokuo

A substrates-washing apparatus includes a process vessel in which washing solution is stored to wash a plurality of substrates, a boat for holding the substrates parallel to one another in the process vessel, solution supply openings formed in the bottom of the process vessel, a solution supply system communicated with the solution supply openings to supply washing solution into the process vessel through the solution supply openings, and a straightening plate arranged between the substrates held on the boat and the solution supply openings in the bottom of the process vessel and provided with a plurality of apertures through which washing solution passes. The apertures form plural lines in the longitudinal direction of the straightening plate, the apertures in each line are arranged to correspond to the substrates alternately, and the apertures in one line are shifted from those in the other adjacent line.

Substrates-washing apparatus

A spindrier comprises a box enclosing a plurality of wafers, a motor for rotating the wafers in the box, upper and lower clamp bars for holding the wafers face to face and substantially perpendicular to a rotating shaft of rotating means, and gas introducing and discharging mechanisms for generating a flow of clean gas in the box. A sectional area of an open bottom of the box is smaller than a sectional area of an open top of the box, and the gas flows from the open top to the open bottom.

Spindrier

A processing vessel suitable for use with a washing system intended to wash a plurality of wafers. The processing vessel includes a washing solution supply source, a circulation pump, a filter, a main vessel portion provided with inlets in the bottom thereof, a boat for holding the plurality of wafers in the center area of the main vessel portion and a flow control assembly arranged between the inlets and the wafers. The flow control assembly includes a scattering plate for scattering washing solution, which is introduced into the main vessel portion through the inlets, in the horizontal direction, and guiding passages through which the washing solution introduced through the inlets is made to have a substantially laminar flow and is guided into the center area of the main vessel portion. The guiding passages are formed by intervals between side plates and the scattering plate and by a plurality of apertures in the scattering plate. These guiding passages enable most of the washing solution to positively flow through spaces between the adjacent wafers. The flow control assembly also include a flow rate reducing section for reducing the amount of the washing solution which flows along the peripheral area of the wafers.

Processing vessel for a wafer washing system

A device for transporting and transferring objects of treatment arranged in a down flow to a plurality of treatment sections for treating the objects comprises a transportation section movable between the treatment sections, a first drive mechanism for moving the transportation section, a first arm movably attached to the transportation section and used for those objects of treatment which are adjusted to a predetermined temperature in the treatment sections, a second arm movably attached to the transportation section and used for the other objects of treatment than the ones adjusted in temperature, and a second drive mechanism for separately moving the first and second arms.

Transportation-transfer device for an object of treatment

Growing community of inventors

Oonojo, Japan

Kenji Yokomizo