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Kioxia Corporation

Kenji Shirakawa

Takeshi Ishihara

Shinji Yamaguchi

Masakazu Taki

Daiki Watanabe

Minoru Hanazaki

Takayuki Ikushima

A method for executing query processing includes, in response to a query from a host, generating a task graph indicating a plurality of task sequences, each of the task sequences capable f performing query processing corresponding to the query. The sequences includes a first sequence that outputs data in a first compression state to a one of output targets, and a second sequence of tasks that outputs the data in a second compression state different from the first compression state to the one of the output targets. The method further includes determining a processing cost for each of the task sequences, selecting one of the task sequences in accordance with the determined processing cost, and performing the query processing corresponding to the query in accordance with the selected task sequence.

Method and database system for optimizing query processing execution scheme

A plasma processing apparatus mainly comprises a processing chamber (,) formed by a vacuum vessel, a magnetic field forming coil (,) arranged around the processing chamber for forming a rotating magnetic field and gas supply means (,) supplying various gases to the processing chamber (,). The processing chamber (,) is divided into a reaction chamber (,) forming plasma with a partition wall (,) and a buffer chamber (,) discharging externally supplied gases with pressure difference. The reaction chamber (,) includes a high-frequency electrode arranged oppositely to the buffer chamber (,). The gas supply means (,) includes pulse gas valves (,and,) for pulsatively supplying gases to the processing chamber (,). Thus provided are a plasma processing method and a plasma processing apparatus capable of uniformly processing a wafer having a large diameter and reducing RIE lag with respect to a fine etching pattern.

Plasma processing method and plasma processing apparatus

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Tokyo, Japan

Kenji Shirakawa