Mitsubishi Jukogyo Kabushiki Kaisha

Nisshin Steel Co., Ltd.

Kawasaki Seitetsu Kabushiki Kaisha

Nihon Nensho System Kabushiki Kaisha

Kenji Atarashiya

Kenichi Yanagi

Toshio Taguchi

Kazuya Tsurusaki

Mitsuo Kato

Ichiro Yamashita

Tadashi Rokkaku

Heisaburo Furukawa

Norihisa Shiraishi

Kaneaki Hyodo

Seiji Yokoro

Yasushi Yoshida

Takuya Akio

Shinji Kamura

Nobuyoshi Oomori

Mitsuhiko Sako

Yoshiteru Moriyama

Toshiyuki Hashime

A DC or high frequency ion source comprising a hollow cathode and a substantially hollow anode for applying a DC or alternating voltage; a gas inlet disposed at a first side of the cathode for supplying a discharge gas into the cathode; a cathode heater disposed between the anode and the cathode; a magnet disposed adjacent the anode to thereby improve the uniformity of a plasma; an ion extraction outlet disposed at a second side of the cathode opposite to the gas inlet and having an elongated rectangular shape; and an ion extraction electrode and an acceleration electrode for controlling the energy of extracted ions. Both the anode and cathode comprise substantially hollow boxes. The cathode includes an elongated rectangular cross section and is disposed inside the substantially hollow anode. The ion extraction electrode and the acceleration electrode have an elongated rectangular shape and an opening coextensive with the ion extraction outlet. The ion extraction electrode and the acceleration electrode are disposed adjacent, and aligned with, the ion extraction outlet. The ion source can be formed with an arcuate shape to accommodate round objects. The ion source can also be formed integrally with a sputtering device.

DC or HF ion source

A sputtering apparatus including two electrodes, a sputtering target disposed on one of the electrodes, and a gas supply for supplying a discharge gas in a vacuum to produce an electric discharge between the two electrodes and whereby particles sputtered from the target due to impact thereon of ions produced by the discharge, are deposited on a substrate. The target disposed on one electrode is formed into an elongated band and the other electrode is disposed so as to enclose the target. The other electrode is also provided with a magnet for producing a magnetic field thereon, and further includes a narrow elongated slot which defines a narrow sputter particle outlet. The narrow sputter particle outlet permits a pressure to exist near the electrical discharge which is higher than the pressure near the substrate. According to a preferred embodiment, the sputtering apparatus has an ion source combined integrally therewith.

Sputtering apparatus and an ion source

An improved vacuum vapor-deposition apparatus comprises an evaporation tank for holding and evaporating vapor deposition material, a hood covering the top of the evporation tank and extended up to its outside in the horizontal direction, inlet and outlet ports of a band to be vapor-deposited, which are opened in the hood so as to penetrate a central portion of the extension on the outside of the evaporation tank, and a vacuum tank covering the evaporation tank and the hood entirely and having sealing devices for carrying in and carrying out the band to be vapor-deposited at the positions corresponding to the inlet and outlet ports in the hood. Vapor deposition is effected within the hood simultaneously onto the both front and rear surfaces of the band to be vapor-deposited. Preferably, the vacuum vapor-deposition apparatus further comprises a vapor amount control device for controlling a vapor amount of the evaporated material led to the both front and rear sides of the band to be vapor-deposited within the hood, and a vapor-deposited surface area control device provided at least on one side of the front and rear sides of the band to be vapor-deposited within the hood for controlling a vapor-deposited surface area of the band to be vapor-deposited. Then, vapor-deposition of different thickness is effected within the hood onto the front and rear surfaces of the band to be vapor-deposited.

Vacuum vapor deposition apparatus

Radiant tube burner

Growing community of inventors

Hiroshima, Japan

Kenji Atarashiya