Intel Corporation

Ken Schatz

Mansour Moinpour

Glen N Wada

Brett E Huff

William G Petro

Yang-Chin Shih

Mike Maxim

Jan V Shubert

A sputter etch system and a method of conducting a sputter etch. The sputter etch system includes an etch chamber with a wafer pedestal having a top surface to support a wafer and a magnet configured to provide a continuous magnetic field directed at the top surface of the wafer pedestal.

Approach to optimizing an ILD argon sputter process

A method of passivating an integrated circuit comprising providing an integrated circuit having a top side including a bond pad, depositing a first dielectric over said top side of said integrated circuit, exposing a first area portion of a top side of said bond pad, depositing a second dielectric of one of a material that is substantially impermeable to moisture over said top side of said integrated circuit, and exposing a second area portion of said top side of said bond pad, said second area portion within said first area portion is disclosed.

Passivation for tight metal geometry

Growing community of inventors

Palo Alto, CA, United States of America

Ken Schatz