Hitachi Chemical Company, Ltd.

Ken Sawabe

Hanako Yori

Masahiko Ogino

Makoto Kaji

Takeshi Nojiri

Toshihiko Akahori

Satoko Ueda

Michiko Natori

Emiko Oota

Yukiko Muramatsu

Shota Okade

Tomoaki Aoki

Sanchoru Ri

Takuya Kajiwara

A photosensitive resin composition includes (A) a binder polymer having a structural unit derived from a hydroxyalkyl (meth)acrylate ester having a hydroxyalkyl group having from 1 to 12 carbon atoms, and a structural unit derived from a (meth)acrylic acid; (B) a photopolymerizable compound having an ethylenically unsaturated bond group; (C) a photopolymerization initiator; and (D) a styryl pyridine represented by the Formula (1). In Formula (1), each of R, Rand Rindependently represents an alkyl group having from 1 to 20 carbon atoms, an alkoxy group having from 1 to 6 carbon atoms, an alkyl ester group having from 1 to 6 carbon atoms, an amino group, an alkyl amino group having from 1 to 20 carbon atoms, a carboxy group, a ciano group, a nitro group, an acetyl group or a (meth)acryloyl group, each of a, b and c independently represents an integer of from 0 to 5. In a case in which each of a, b and c is independently 2 or more, the plural Rs, Rs, and Rs independently may be the same or different. 

Photosensitive resin composition, photosensitive element, method for producing substrate with resist pattern, and method for producing printed wiring board

The present invention relates to a positive-type photosensitive resin composition comprising (A) a modified novolac-type phenol resin having an unsaturated hydrocarbon group, (B) a novolac-type phenol resin obtained from metacresol and paracresol, (C) a novolac-type phenol resin obtained from orthocresol, (D) a compound generating an acid by light, and (E) a polybasic acid or a polybasic acid anhydride, wherein the content of the (E) component is lower than 40 parts by mass per 100 parts by mass of the total amount of the (A) component, the (B) component, the (C) component and the (D) component.

Photosensitive resin composition and photosensitive film using same

A photosensitive resin composition comprising (a) a compound obtained by reacting a polybasic acid anhydride with the phenolic hydroxyl groups of a novolac-type phenol resin, and (b) a 1,2-quinonediazide compound. The photosensitive resin composition, which comprises component (b) composed of a 1,2-quinonediazide compound in combination with a component (a) obtained by reacting a polybasic acid anhydride with the phenolic hydroxyl groups of a novolac-type phenol resin, exhibits sufficiently high photosensitivity, image contrast, resolution and adhesiveness.

Photosensitive resin composition and photosensitive element

Provided is a new photo-curable resin composition which can be used in a photo nanoimprinting technology available for a photo nanoimprinting technology by which a substrate is processed with high accuracy. The photo-curable resin composition contains a photo-curable resin material essentially containing a (meth)acrylate, a reactive diluent, and a photo initiator. Preferably, the (meth)acrylate has a structure containing a benzene ring structure in its skeleton.

Photo-curable resin composition and a method for forming a pattern using the same

A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizing compound with an ethylenic unsaturated bond, (C) a photopolymerization initiator and (D) a compound represented by the following general formula (1) or (2). [Chemical Formula 1] [wherein X, X, X, X, Xand Xeach independently represent a CH group, CCHgroup, CCHgroup or nitrogen, Y, Y, Yand Yeach independently represent optionally substituted aryl, and Yrepresents optionally substituted arylene].

Photosensitive resin composition, photosensitive element, resist pattern forming method and process for manufacturing printed circuit board

An object of the present invention is to provide a process for producing a printed wiring board, which is advantageous not only in that the reduction in size and increase in density of the wiring board are achieved and further the steps are simplified, but also in that the connection reliability of mount parts and the yield are improved, and a photosensitive resin composition used in the process. The present invention is directed to a process for producing a printed wiring board, comprising the steps of: (i) forming a solder resist on a wiring board having a circuit; (ii) laminating a preliminarily molded layer of a photosensitive resin composition on the solder resist; (iii) subjecting the layer of the photosensitive resin composition to exposure and development to form a resist pattern of the photosensitive resin composition; (iv) subjecting the entire surface of the resultant board to electroless plating, and (v) stripping the layer of the photosensitive resin composition, wherein the steps are conducted in this order, as well as a photosensitive resin composition and the layer thereof used in the process.

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Hitachi, Japan

Ken Sawabe