Hitachi Chemical Company, Ltd.

Ken Nanaumi

Takumi Ueno

Hiroshi Matsutani

Alexandre Nicolas

Kazumasa Takeuchi

Susumu Konii

Takeshi Yoshida

Yukio Yoshimura

Tetsuya Saito

Kohei Yasuzawa

Toyotaro Shinko

Akira Nagai

Hikari Murai

Atsushi Takahashi

Kazunori Yamamoto

Shinsuke Hagiwara

Haruaki Sue

Minoru Kakitani

Shinichi Kamoshida

Mitsuhiro Inoue

Takao Hirayama

Toshihiko Ito

Akinari Kida

Koji Morita

Yasuyuki Hirai

Yukihiko Yamashita

Takeshi Horiuchi

Mitsuyoshi Hamada

Hiroaki Hirakura

Yoshiyuki Takeda

Toshihisa Kumakura

Akitoshi Tanimoto

Teruki Aizawa

Yoshihiro Nakamura

Ryoichi Ikezawa

Norihiro Abe

Ken Madarame

Kenichi Oohori

Syunichi Numata

Hiroaki Ikeba

Hideki Eriguchi

Kouhei Yasuzawa

Takuji Itou

Masahiro Nomoto

Kiyoshi Hirosawa

Shinji Ogi

Shinichi c/o Shimodate Works Hitachi Kamoshida

Hikari c/o Shimodate Works Hitachi CHEMCO Murai

Minoru c/o Shimodate Works Hitachi Kakitani

A positive-type photosensitive resin composition includes (A) a phenol resin modified by a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms; (B) a compound that produces an acid by light; (C) a thermal crosslinking agent; and (D) a solvent. The positive-type photosensitive resin composition according to the present invention can be developed by an alkaline aqueous solution, and an effect thereof is that a resist pattern having sufficiently high sensitivity and resolution, excellent adhesion, and good thermal shock resistance can be formed.

Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device

The positive tone photosensitive composition of the invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound producing an acid by light, a thermal crosslinking agent and an acrylic resin. It is possible to provide a positive tone photosensitive composition that can be developed with an aqueous alkali solution, has sufficiently high sensitivity and resolution, and can form a resist pattern with excellent adhesiveness and thermal shock resistance.

Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device

A positive tone photosensitive composition comprising: (A) an alkali-soluble resin having a phenolic hydroxyl group; (B) a phenol resin modified by a compound having an unsaturated hydrocarbon group containing 4 to 100 carbon atoms; (C) a compound that generates an acid by the action of light; (D) a thermal cross-linker that crosslinks the ingredient (A) and the ingredient (B) by heating; and (E) a solvent.

Positive-type photosensitive resin composition, method for producing resist pattern, and electronic component

The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.

Epoxy resin molding material for sealing and electronic component device

The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.

Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin

Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient.

Adhesive film formed of a siloxane-modified polyamideimide resin composition, adhesive sheet and semiconductor device

Siloxane-modified polyamideimide resin composition, adhesive film, adhesive sheet and semiconductor device

Provided is bonding film for printed circuit boards which is resistant to cracking even when bent with a small radius of curvature, has a sufficient mechanical strength even in its semi-cured state so that the handling may be facilitated, is not undesirably brittle and therefore does not produce undesired debris when cut, and is flexible and flame retardant at the same time. The bonding film may consist of (i) high polymer epoxy resin; (ii) denatured polyamide obtained by reacting epoxy resin and polyamide; (iii) polyfunctional epoxy resin; and (iv) curing agent. Preferably, the denatured polyamide includes a polyalkylene-glycol residue or a polycarbonate-diol residue. Preferably, the high polymer epoxy resin is produced by the polymerization of bifunctional epoxy resin and bifunctional phenol resin, and has a weight averaged molecular weight equal to 50,000 or higher.

Bonding film for printed circuit boards

A catalyst selected from a perfluorosulfonic acid and an anhydride thereof enables a non-conjugated drying oil to react with a phenol to form a phenol-added vegetable oil without causing hydrolysis of the non-conjugated drying oil. The phenol-added vegetable oil is allowed to react with an aldehyde to form a vegetable oil-modified phenolic resin. A laminate produced by impregnating paper with the vegetable oil-modified phenolic resin and laminating and molding the impregnated paper is excellent in low temperature punching quality and electrical properties and is free from low molecular weight components oozing out the surface of the laminate.

Method of preparing vegetable oil-modified phenolic resin and laminate

A copolycondensation of a phenol, a naphthol and formaldehyde proceeds smoothly in the presence of an acid and a metallic element selected from the group consisting of transition metallic elements and metallic elements of Group IIa, Group IIIa, Group IVa, Group Va and Group VIa of the Periodic Table, and a naphthol-modified phenolic resin which has a large molecular weight and does not gel is obtained.

Method of producing a naphthol-modified phenolic resin of highly

An adhesive composition for metal-clad laminates which comprises:

Adhesive composition for metal-clad laminates

Internally plasticized phenolic resins suitable for use in preparing laminates and the like excellent in electrical properties, heat resistance, solvent resistance as well as punchability are produced by reacting a compound of the formula: ##STR1## wherein R.sub.1 is an alkylene residue having 1 to 3 carbon atoms; and R.sub.2 and R.sub.3 are independently hydrogen or a saturated or unsaturated hydrocarbon group having 1 to 3 carbon atoms, with an epoxidized vegetable oil with heating in the presence of one or more secondary and/or tertiary amines, and adding formaldehyde or one or more phenols and formaldehyde to the reaction system to further proceed the reaction.

Process for producing phenolic resins

Internally plasticized phenolic resins suitable for use in preparing laminates and the like excellent in electrical properties, heat resistance, solvent resistance as well as punchability are produced by reacting a phenol-formaldehyde resin containing less than 4% by weight of unreacted free monohydric phenol or phenols with an epoxidized vegetable oil, and if required with formaldehyde, with heating preferably in the presence of one or more secondary and/or tertiary amines.

Process for producing internally plasticized phenolic resins

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Chikusei, Japan

Ken Nanaumi