Zeta Instruments, Inc.

Ultrapointe Corporation

Kla Tencor Corporation

Other

Core Tech Optical, Inc.

Uniphase Corporation

Ken K Lee

James Jianguo Xu

Rusmin Kudinar

Zhen Hou

Ronny Soetarman

Hung Phi Nguyen

Bruce W Worster

Christopher R Fairley

Vamsi Mohan Velidandla

Timothy V Thompson

Ben Garland

Imran N Chaudhri

Dale E Crane

Hans J Hansen

Young D Kim

Ronny Soetaman

James Nelson Stainton

Ke Han

Lakshman Srinivasan

Bruce Worster

Christopher R Fairlay

John E Fertig

Nitigya Kathuria

A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities. These capabilities include Nomarski imaging, polarized light imaging, quantitative differential interference contrast (q-DIC) imaging, motorized polarized light imaging, phase-shifting interferometry (PSI), and vertical-scanning interferometry (VSI).

3D microscope including insertable components to provide multiple imaging and measurement capabilities

A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator, the focusing adjustment device, and the optical sensor. The processor can be configured to capture first and second images at multiple Z steps, the first image with the pattern using the reflected illuminator and the second image without the pattern using one of the reflected illuminator and the transmitted illuminator.

3D microscope and methods of measuring patterned substrates

A method of generating 3D information of a sample using an optical microscope includes: varying the distance between the sample and an objective lens of the optical microscope at pre-determined steps, capturing an image at each pre-determined step, determining a characteristic value of each pixel in each captured image, determining a first captured image that is focused on a first surface of the sample based on the characteristic value of each pixel in each captured image, and determining a measurement of an opening in the first surface of the sample based on the first captured image. The first surface of the sample and the second surface of the sample are within a field of view of each of the captured images. The first captured image includes a pattern overlay. In another example, the opening measurement is determined using a second captured image without a pattern overlay.

Optical measurement of opening dimensions in a wafer

A method of detecting multi-surfaces of an object includes providing an imaging system capable of detecting surfaces of the object. After system parameters are set up, two-dimensional images of the object at multiple Z steps can be acquired. Each surface of the object can then be extracted using two steps. In a first step, the surface can be constructed based on a confidence threshold. In a second step, the surface can be enhanced using an interpolation filter.

Multi-surface optical 3D microscope

A measurement system for monitoring an LED chip surface roughening process is described. A reflective illuminator can run reflectance measurements. A vertical positioning means can adjust a distance between an objective lens and an industrial sample. A horizontal positioning means can move objects in XY plane, and is specifically configured to hold the industrial sample and a reference sample. An optical sensor can acquire images of the industrial sample. A spectrometer can acquire reflectance spectrums of the industrial sample and the reference sample. A processor can control these components. The processor can perform deskew, and calculate an average reflectance and an oscillation amplitude from the reflectance spectrums of the industrial sample.

System and method for monitoring LED chip surface roughening process

A compact and low cost microscope illuminator capable of generating 3-D optical images includes a first light source and a second light source. The two light sources lead two optical paths: one to illuminate a sample and another to project a pattern onto the focal plane of a microscope objective lens. The two light sources are controlled by a processor and can be turned on and off rapidly. A 3-D optical microscope equipped with said microscope illuminator and a method of creating a 3-D image on said 3-D optical microscope are also described.

Illuminator for a 3-D optical microscope

A 3-D optical microscope, a method of turning a conventional optical microscope into a 3-D optical microscope, and a method of creating a 3-D image on an optical microscope are described. The 3-D optical microscope includes a processor, at least one objective lens, an optical sensor capable of acquiring an image of a sample, a mechanism for adjusting focus position of the sample relative to the objective lens, and a mechanism for illuminating the sample and for projecting a pattern onto and removing the pattern from the focal plane of the objective lens. The 3-D image creation method includes taking two sets of images, one with and another without the presence of the projected pattern, and using a software algorithm to analyze the two image sets to generating a 3-D image of the sample. The 3-D image creation method enables reliable and accurate 3-D imaging on almost any sample regardless of its image contrast.

3-D optical microscope

Growing community of inventors

Los Altos, CA, United States of America

Ken K Lee