Ebara Corporation

Is Engineering Co., Ltd.

Keisuke Uchiyama

Yu Ishii

Kenya Ito

Masayuki Nakanishi

Tetsuji Togawa

Kenichi Kobayashi

Makoto Kashiwagi

Satoru Yamamoto

Kunio Oishi

Kenji Kodera

Hiroyuki Takenaka

Hokuto Yamanobe

Tomiichi Matsui

Mahito Shibuya

The present invention relates to a substrate cleaning method and a substrate cleaning apparatus for cleaning a substrate, such as a wafer. The substrate cleaning method includes: holding a periphery of a substrate (W) with holding rollers (); rotating the substrate (W) about its central axis by rotating the holding rollers () about their respective central axes; delivering a two-fluid jet from a two-fluid jet nozzle () to a surface of the substrate (W) while moving the two-fluid jet nozzle () in a radial direction of the substrate (W), the two-fluid jet () being composed of a mixture of a first liquid and a gas; and when the two-fluid jet is being delivered to the surface of the substrate (W), delivering a fan-shaped jet of a second liquid from a spray nozzle () to the surface of the substrate (W) to form a flow of the second liquid on the surface of the substrate (W). The fan-shaped jet is located away from the two-fluid jet.

Substrate cleaning method and substrate cleaning apparatus

A substrate processing apparatus for processing a substrate includes a setting device that sets a plurality of recipe items including operation conditions of the substrate processing apparatus and a recipe generating device that acquires a plurality of recipe models obtained by changing values of the plurality of recipe items and experimenting or simulating a processing result of the substrate and analyzes the plurality of recipe models to generate a recipe, the recipe generating device combining a part or all of the plurality of recipe models to generate the recipe such that a calculation value of a processing result of the substrate by the recipe satisfies a predetermined condition.

Substrate processing apparatus and storage medium having program stored therein

An apparatus and a method which can perform different processes, such as polishing and cleaning, on a surface of a substrate, such as a wafer, with a single processing head, and can process the surface of the substrate efficiently are disclosed. The apparatus includes: a substrate holder configured to hold a substrate and rotate the substrate; and a processing head configured to bring scrubbing tapes into contact with a first surface of the substrate to process the first surface. The processing head includes: pressing members arranged to press the scrubbing tapes against the first surface of the substrate; position switching devices configured to be able to switch positions of the pressing members between processing positions and retreat positions; tape feeding reels configured to feed the scrubbing tapes, respectively; and tape take-up reels configured to take up the scrubbing tapes, respectively.

Apparatus and method for processing a surface of a substrate

A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.

Method and apparatus for polishing a substrate, and method for processing a substrate

A polishing method capable of polishing a substrate, such as a wafer, with low running costs is disclosed. A polishing method includes: rotating a substrate while holding a back-side surface of the substrate with a vacuum suction stage; rotating a polishing head holding a plurality of polishing tools; and polishing a front-side surface of the substrate by pressing the plurality of polishing tools, which are rotating, against the front-side surface of the substrate. The front-side surface is a surface on which interconnect patterns are to be formed.

Polishing method, polishing apparatus, and substrate processing system

An apparatus which can remove particles, such as polishing debris, from a back surface with high removal efficiency is provided. The apparatus includes: a substrate holder configured to rotate the substrate while holding the substrate with the back surface facing upward; a scrub cleaning tool configured to be rotatable; a two-fluid nozzle disposed above the substrate holder; and a housing defining a cleaning chamber in which the substrate holder, the scrub cleaning tool, and the two-fluid nozzle are located.

Apparatus and method for cleaning a back surface of a substrate

An apparatus which can polish an entirety of a surface of a substrate, such as a wafer, is disclosed. The apparatus includes a substrate holder configured to hold a substrate and rotate the substrate; and a polishing head configured to rub a polishing tool against a first surface of the substrate to polish the first surface. The substrate holder includes a plurality of rollers which can contact a periphery of the substrate. The plurality of rollers are rotatable about their respective own axes.

Apparatus and method for polishing a surface of a substrate

There is disclosed a substrate processing apparatus which is capable of detecting whether a substrate, such as a wafer, supported by a fluid is properly present in a predetermined processing position or not. The substrate processing apparatus includes at least one distance sensor configured to measure a distance between a scrubber and a hydrostatic support structure; and a processing controller configured to calculate a gap between the hydrostatic support structure and the surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.

Substrate processing apparatus

A tape sticking apparatus for sticking a masking tape for protecting a peripheral portion of a substrate, such as a wafer, is disclosed. The tape sticking apparatus includes: a substrate holder configured to hold and rotate a substrate; and a tape sticking unit configured to stick a masking tape onto a peripheral portion of the substrate held on the substrate holder.

Growing community of inventors

Tokyo, Japan

Keisuke Uchiyama