Tokyo Electron Limited

Keisuke Sasaki

Suguru Enokida

Koji Tanaka

Akihiro Teramoto

Kazuyoshi Eshima

Masashi Tsuchiyama

Yuzo Ohishi

Shoichi Terada

Yukiyoshi Saito

Keisuke Yoshida

Keita Hirase

A substrate processing system includes: a carry-in/out section in which a cassette accommodating a plurality of substrates is carried in/out; a batch processing section in which a wafer lot including the plurality of substrates is collectively processed; a single-wafer processing section in which the substrates of the wafer lot is processed one by one; and an interface section that delivers the substrates between the batch processing section and the single-wafer processing section. The batch processing section includes: a processing bath in which the wafer lot is immersed and processed; and a first transfer device that transfers the wafer lot to the processing bath. The interface section includes: an immersion bath disposed outside a movement range of the first transfer device and that immerses the wafer lot; and a second transfer device that holds and transfers the wafer lot between the first transfer device and the immersion bath.

Substrate processing system and substrate processing method

There is provided a substrate processing apparatus for processing a substrate, including: a storage part provided on an uppermost portion of the substrate processing apparatus and on which a substrate accommodation container for accommodating the substrate is placed; and a first transfer device configured to directly or indirectly deliver the substrate accommodation container between the storage part and a loading/unloading part, wherein the loading/unloading part is configured to place the substrate accommodation container thereon in the substrate processing apparatus and to load and unload the substrate into and from a processing part of the substrate processing apparatus, and the first transfer device is configured to deliver the substrate accommodation container with respect to an overhead hoist transport that moves above the substrate processing apparatus.

Substrate processing apparatus and substrate processing method

A substrate processing apparatus includes a hot plate which supports and heats a substrate, a light source which emits etching energy beam such that the etching energy beam etches the substrate held by the hot plate, a window device which is positioned between the light source and the hot plate and transmits the etching energy beam emitted by the light source toward the substrate, and an adjusting device which adjusts emission amounts of the etching energy beam from portions of the window device toward the substrate such that the adjusting device reduces difference in etching amounts of portions of the substrate.

A process liquid supply system includes a pure water supply source connected to a process vessel through a supply pipe; a chemical liquid tank that stores a chemical liquid and supplies the chemical liquid stored therein to the supply pipe; and a compressed gas supply source connected to the chemical liquid tank through a compressed gas supply pipe. A pressure adjusting part is disposed on the compressed gas supply pipe at a position between the compressed gas supply source and the chemical liquid tank. The pressure adjusting part is controlled so that the pressure of the compressed gas supplied from the compressed gas supply source to the chemical liquid tank is gradually or stepwise increased after the supply of the chemical liquid from the chemical liquid tank to the supply pipe is started so that the concentration of the processing liquid remains at desired level.

Growing community of inventors

Kumamoto, Japan

Keisuke Sasaki