Mec Company Ltd.

Keisuke Joko

Daisaku Akiyama

Itsuro Tomatsu

Yasutaka Amitani

Tokuya Satomi

Yoichi Sengoku

Kiyoto Tai

Tsuyoshi Amatani

Masao Okada

Masaru Takahashi

Masami Tsutae

Ryoko Mitani

Yoichi Tsutae

The coating film-forming composition is a solution of pH 4 to 10 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and an oxidizing agent. As the oxidizing agent, hypochlorous acid, chlorous acid, chloric acid, perchloric acid, persulfuric acid, percarbonic acid, hydrogen peroxide, organic peroxides, or the like is used. The aromatic compound preferably contains a nitrogen-containing aromatic ring, and more preferably contains a primary amino group or a secondary amino group. The coating film-forming composition is used for, for example, forming a coating film on surface of a metal member.

Composition for forming coating, production method for surface-treated metal member, and production method for metal-resin composite

The coating film-forming composition is a solution of pH 6 to 9 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and a halide ion. The content of polybasic acid in the coating film-forming composition is 0.05 to 10 times the content of aromatic compound, and the halide ion concentration is 5 to 600 mM. A coating film with excellent adhesion to a resin can be formed on a surface of a metal member by bringing the coating film-forming composition into contact with the surface of the metal member.

Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite

Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25&#xb0; C., and a salt thereof, has a pH of more than 4 and not more than 7 at 25&#xb0; C., and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating.

Coating-forming liquid composition and coating-forming method therewith

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Hyogo, Japan

Keisuke Joko